Senior Spacecraft Structural Analyst - Electronics Packaging

Blue Origin; Denver (CO); On-site; USD 134,000 - 187,000; Full time

Benefits offered by this job

Stock Options

Medical/Dental/Vision

Paid Parental Leave

401(k) with company match

Paid Time Off

Job summary

Blue Origin is seeking a Senior Structural Analyst – Electronics Packaging in Colorado to own structural analysis for satellite LRUs, avionics enclosures, and electronics assemblies from concept through production release.

You will build FEA models, verify vibration and thermal performance, and collaborate with design, electrical, and test teams to ensure robust packaging and manufacturability.

Qualifications

• Bachelor’s degree in Mechanical, Aerospace, Structural Engineering or related field.
• 8+ years of structural analysis experience with aerospace, spacecraft, launch vehicle, defense, or high-reliability hardware.
• Experience analyzing avionics, electronics packaging, enclosures, LRUs, PCBAs, or similar hardware for vibration, shock, and thermal environments.
• Proficiency with FEA tools such as NASTRAN, ANSYS, Abaqus, FEMAP, HyperMesh, or equivalent.
• Strong knowledge of classical structural analysis, including bolted joints, fasteners, brackets, plates, beams, inserts, load paths, margins, and fatigue.
• Experience with dynamic environments, including modal, random vibration, sine vibration, and shock.
• Experience supporting qualification or acceptance testing, including planning, instrumentation, data review, model correlation, and anomaly resolution.
• Must be a U.S. citizen or national, U.S. permanent resident, or eligible under specified statuses.

Responsibilities

• Own structural analysis for TeraWave satellite LRUs, avionics enclosures, electronics assemblies, and power electronics from concept through qualification and production release.
• Analyze electronics packaging hardware, including chassis, covers, mounting interfaces, card guides, wedge locks, fasteners, brackets, connectors, PCBAs/CCAs, and internal supports.
• Build and maintain detailed FEA and simplified analytical models using NASTRAN, ANSYS, Abaqus, or equivalent tools.
• Verify strength, stiffness, modal response, vibration, shock, fatigue, thermal-mechanical performance, and load paths using FEA and classical methods.
• Define structural environments, assumptions, boundary conditions, and interface loads with structures, systems, design, and test teams.
• Assess margins of safety for enclosures, bolted joints, inserts, card retention features, solder joints, components, connectors, and mounting feet.
• Partner with mechanical design engineers to drive structural requirements into enclosure design, PCB layout, component placement, and mounting strategy.
• Define structural test requirements and support qualification/acceptance testing, including vibration, shock, sine burst, modal, and environmental campaigns.
• Correlate models to test data, investigate anomalies, and recommend design or process improvements.
• Review supplier analyses and test data for compliance with Blue Origin and TeraWave requirements.
• Author analysis reports, margin summaries, test plans, test reports, and certification documentation.
• Present analysis results, risks, and recommendations at design, qualification, and production readiness reviews.
• Mentor junior analysts and design engineers in electronics packaging analysis methods.
• Develop repeatable analysis methods, templates, and allowables for high-rate satellite production.

Skills

Structural analysis

Vibration analysis

Modal analysis

Team collaboration

Education

Bachelor’s degree in Mechanical/Aerospace/Structural Engineering

Master’s degree preferred

Tools

NASTRAN

ANSYS

Abaqus

FEMAP

HyperMesh

Job description

Blue Origin is seeking a Senior Structural Analyst – Electronics Packaging in Colorado to own structural analysis for satellite LRUs, avionics enclosures, and electronics assemblies from concept through production release.

You will build FEA models, verify vibration and thermal performance, and collaborate with design, electrical, and test teams to ensure robust packaging and manufacturability.