Senior Signal & Power Integrity Applications Engineer

Cadence Design Systems; San Jose (CA); On-site; USD 84,000 - 156,000; Full time

Benefits offered by this job

Paid vacation and holidays

401(k) plan with employer match

Employee stock purchase plan

Medical, dental and vision options

Job summary

Cadence Design Systems is seeking a technically skilled professional to support sales campaigns with workshops, demos and onsite training. You will have expert knowledge of Cadence toolsets and related flows for high-speed signal design, power integrity, and thermal analysis across IC, package and PCB designs.

The role requires strong communication, presentation and teamwork abilities, with on-site customer interaction and cross-group collaboration to ensure customer success.

Qualifications

• Bachelor's or Master's degree in Electrical or Electronics Engineering with 1-3 years related experience (level flexible).
• Solid knowledge of EDA industry with strong background in Signal Integrity, Power Integrity, and Electromagnetics, related to Package and PCB Design.
• Experience with Cadence Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP, or competitive tools.

Responsibilities

• Support technical campaigns by delivering workshops, product demonstrations, training, and onsite support.
• Collaborate with Sales Account Managers and field application engineers to analyze customer environments and propose solutions.
• Lead technical discussions and present solutions to medium to large groups.

Skills

Communication skills

Presentation skills

Customer-facing

Team collaboration

Analytical thinking

Education

Bachelor's or Master's in Electrical Engineering

Tools

Cadence Allegro

Sigrity

Clarity

PCB Editor

ICP

Job description

Cadence Design Systems is seeking a technically skilled professional to support sales campaigns with workshops, demos and onsite training. You will have expert knowledge of Cadence toolsets and related flows for high-speed signal design, power integrity, and thermal analysis across IC, package and PCB designs.

The role requires strong communication, presentation and teamwork abilities, with on-site customer interaction and cross-group collaboration to ensure customer success.