Senior Signal Integrity Engineer - 3D/2.5D Interconnects

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grant

Annual equity awards

401K with company match

ESPP

Job summary

Broadcom is seeking an experienced SI/PI engineer to advance next-generation IC interconnects and IP, working across MCM, 2.5D, and 3D spaces. The role blends AE/R&D activities, requires global collaboration with customers and partners, and focuses on sign-off excellence in power and signal integrity.

The candidate will join the ASIC Products Division to design, analyze, and optimize interconnects, while supporting development of new technologies and ensuring robust sign-off flows for demanding

Qualifications

• Bachelor's degree with 12+ years of related experience or Master's with 10+ years of related experience.
• Experience in SI/PI sign-off flow for DDR/LPDDR and/or HBM interconnects.
• Ability to work across a worldwide organization and customer base.
• Comfortable guiding teams with incomplete information.

Responsibilities

• Mask-based timing signoff using time-domain simulations for parallel interfaces (2.5D/3D).
• EM modeling of signal and power delivery channels (PCB, package, interposers).
• AC and transient PDN analysis and IO channel analysis.
• Pre-layout modeling of transceivers and PDN networks.
• Automate sign-off processes and collaborate with EDA vendors to improve tools and flows.
• Prepare analysis results, presentations, and sign-off reports for customers and internal teams.

Skills

TCL scripting

Python scripting

Sign-off tools

SI/PI engineering

Parallel interfaces

Education

Bachelor's degree + 12+ years

Master's degree + 10+ years

Tools

DDR/LPDDR sign-off tools

HBM sign-off tools

EDA tools

Job description

Broadcom is seeking an experienced SI/PI engineer to advance next-generation IC interconnects and IP, working across MCM, 2.5D, and 3D spaces. The role blends AE/R&D activities, requires global collaboration with customers and partners, and focuses on sign-off excellence in power and signal integrity.

The candidate will join the ASIC Products Division to design, analyze, and optimize interconnects, while supporting development of new technologies and ensuring robust sign-off flows for demanding