Signal Integrity Engineer

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grant

Annual equity awards

401K with company match

ESPP

Job summary

Broadcom is seeking an experienced SI/PI engineer to advance next-generation IC interconnects and IP, working across MCM, 2.5D, and 3D spaces. The role blends AE/R&D activities, requires global collaboration with customers and partners, and focuses on sign-off excellence in power and signal integrity.

The candidate will join the ASIC Products Division to design, analyze, and optimize interconnects, while supporting development of new technologies and ensuring robust sign-off flows for demanding

Qualifications

• Bachelor's degree with 12+ years of related experience or Master's with 10+ years of related experience.
• Experience in SI/PI sign-off flow for DDR/LPDDR and/or HBM interconnects.
• Ability to work across a worldwide organization and customer base.
• Comfortable guiding teams with incomplete information.

Responsibilities

• Mask-based timing signoff using time-domain simulations for parallel interfaces (2.5D/3D).
• EM modeling of signal and power delivery channels (PCB, package, interposers).
• AC and transient PDN analysis and IO channel analysis.
• Pre-layout modeling of transceivers and PDN networks.
• Automate sign-off processes and collaborate with EDA vendors to improve tools and flows.
• Prepare analysis results, presentations, and sign-off reports for customers and internal teams.

Skills

TCL scripting

Python scripting

Sign-off tools

SI/PI engineering

Parallel interfaces

Education

Bachelor's degree + 12+ years

Master's degree + 10+ years

Tools

DDR/LPDDR sign-off tools

HBM sign-off tools

EDA tools

Job description

Job Description: The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as artificial intelligence/machine learning AI/ML, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.

The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as artificial intelligence/machine learning AI/ML, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects. We are seeking an experienced SI/PI engineer to develop our next generation products with a focus on parallel interfaces. The job requires aspects of both a successful AE and R&D engineer. The candidate will work on a mix of customer products and development of new interconnect technologies and IP in the MCM, 2.5D, and 3D spaces, working alongside R&D, IP development, customers, and manufacturing partners. This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities

• Mask based timing signoff using time domain simulations (SPICE, etc.) of parallel interfaces including 2.5D and 3D.
• Electromagnetic extraction and modeling of signal and power delivery channels (PCB, Package, Interposers, etc.).
• AC and transient analysis of Power Distribution Networks.
• IO channel analysis.
• Pre-layout modeling of transceivers as well as signal and PDN networks.
• Automate sign-off processes and work with EDA suppliers to improve tool accuracy and analysis flow.
• Generate analysis results, create presentations, sign-off reports, and support pre-sales activities to both customers and internal teams.

Skills and Experience

• Independent, self-starter who can work across a worldwide organization and customer base.
• Ability to manage multiple concurrent customers under short timelines.
• Comfortable with providing guidance and direction with incomplete information.
• Knowledge of at least one DDR/LPDDR and/or HBM SI/PI sign-off flow tool suite.
• Ability to manage analysis, documentation, and presentation roles.
• Flexibility to integrate new ideas and tools to enhance signoff capabilities.
• Experience with various IC, Package and PCB database types.
• TCL, Python scripting experience to automate routine tasks.
• Bachelors and 12+ years of related experience; or Masters degree and 10+ years of related experience

Compensation And Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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