Senior Physical Design Engineer — 3D/2.5D IC Interconnects

Broadcom

San Jose (CA)

On-site

USD 144,000 - 230,000

Full time

2 days ago
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Job summary

Broadcom is seeking a seasoned design engineer with a strong background in physical layout to drive next-generation ASIC products. The role focuses on 2.5D and 3D interconnects, with collaboration across R&D, IP development, customers, and manufacturing partners.

The candidate will design and implement power grids, die-to-die interconnects, and high-speed interfaces, while automating processes and performing critical electrical analyses to ensure performance and manufacturability.

Qualifications

  • Bachelor's or Master's degree required with 10+ years (or 12+ for Bachelor's) experience in IC/PCB layout domains.
  • Experience across IC, package and PCB layout databases/tools is essential.
  • Strong scripting (TCL/Python) to automate repetitive design tasks.

Responsibilities

  • Implement physical layout for power grids and 2.5D/3D die-die interconnects.
  • Perform DRC/LVS checks and electrical rule verification.
  • Automate common layout steps to improve efficiency.
  • Develop high-speed signal interconnects with SI/PI teams.
  • Analyze and optimize ubump and RDL patterns for reliability.
  • Explore new 2.5D/3D interconnect technologies and roadmaps.

Skills

TCL scripting
Python scripting
Independent self-starter
Multi-project management
Layout/tool experience

Education

Bachelor's in Electrical Engineering or CS
Master's in Electrical Engineering or CS

Tools

IC/Package/PCB layout tools

Job description

Broadcom is seeking a seasoned design engineer with a strong background in physical layout to drive next-generation ASIC products. The role focuses on 2.5D and 3D interconnects, with collaboration across R&D, IP development, customers, and manufacturing partners.

The candidate will design and implement power grids, die-to-die interconnects, and high-speed interfaces, while automating processes and performing critical electrical analyses to ensure performance and manufacturability.

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