Senior SI/PI Engineer - HBM & 2.5D/3D Interposers

Micron Technology, Inc.

Richardson, Northern (TX, KY)

Hybrid

USD 140,000 - 210,000

Full time

14 days+

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Job summary

Micron Technology, Inc. in Richardson, TX is seeking a Principal Engineer to serve as a SI/PI technical authority for 2.5D/3D interposer-based memory systems, shaping system-level decisions that affect performance, reliability, and power.

You will own signal integrity analyses and drive power delivery architectures across PCB, package, and interposer designs. The role demands 7+ years of SI/PI modeling experience, strong electromagnetics knowledge, and hands-on experience with industry tools

Qualifications

7+ years of experience in signal integrity and power integrity modeling and analysis.
Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design.
Hands-on experience with industry-standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight.

Responsibilities

Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation.
Define and drive power delivery architecture, impedance targets, and transient analysis.
Perform electromagnetic extraction and modeling across PCB, package, and interposer designs.
Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
Provide clear technical direction in ambiguous or incomplete design environments.