Principal Engineer - HBM Interposer SI/PI & 2.5D/3D

Micron Technology; Richardson (TX); On-site; USD 175,000 - 309,000; Full time

Benefits offered by this job

Medical/dental/vision

Paid time off

Equity

401(k)

Job summary

Micron Technology is seeking a Principal Engineer for the Heterogeneous Integration Group to lead SI/PI analyses for advanced interposer designs. You will shape power delivery strategies, drive impedance targets, and guide electromagnetic modeling across boards, packages, and interposers.

The role requires 7+ years of SI/PI experience, with hands-on use of industry EDA tools and a strong background in high-bandwidth interfaces such as HBM and SERDES.

Qualifications

• 7 years of experience in signal integrity and power integrity modeling and analysis.
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design.

Responsibilities

• Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation.
• Define and drive power delivery architecture, impedance targets, and transient analysis.
• Perform electromagnetic extraction and modeling across PCB, package, and interposer designs.
• Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
• Provide clear technical direction in ambiguous or incomplete design environments.

Skills

Signal integrity

Power integrity

EM modeling

I/O design

Tools

ANSYS

Synopsys

Cadence

Keysight

Job description

Micron Technology is seeking a Principal Engineer for the Heterogeneous Integration Group to lead SI/PI analyses for advanced interposer designs. You will shape power delivery strategies, drive impedance targets, and guide electromagnetic modeling across boards, packages, and interposers.

The role requires 7+ years of SI/PI experience, with hands-on use of industry EDA tools and a strong background in high-bandwidth interfaces such as HBM and SERDES.