HBM SIPI, Principal Engineer

Micron Technology; Richardson (TX); On-site; USD 175,000 - 309,000; Full time

Benefits offered by this job

Medical/dental/vision

Paid time off

Equity

401(k)

Job summary

Micron Technology is seeking a Principal Engineer for the Heterogeneous Integration Group to lead SI/PI analyses for advanced interposer designs. You will shape power delivery strategies, drive impedance targets, and guide electromagnetic modeling across boards, packages, and interposers.

The role requires 7+ years of SI/PI experience, with hands-on use of industry EDA tools and a strong background in high-bandwidth interfaces such as HBM and SERDES.

Qualifications

• 7 years of experience in signal integrity and power integrity modeling and analysis.
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design.

Responsibilities

• Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation.
• Define and drive power delivery architecture, impedance targets, and transient analysis.
• Perform electromagnetic extraction and modeling across PCB, package, and interposer designs.
• Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
• Provide clear technical direction in ambiguous or incomplete design environments.

Skills

Signal integrity

Power integrity

EM modeling

I/O design

Tools

ANSYS

Synopsys

Cadence

Keysight

Job description

Principal Engineer – Heterogeneous Integration Group

Micron Technology is a global leader in memory and storage solutions, driving the transformation of information into intelligence.

Responsibilities

• Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation.
• Define and drive power delivery architecture, impedance targets, and transient analysis.
• Perform electromagnetic extraction and modeling across PCB, package, and interposer designs.
• Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
• Provide clear technical direction in ambiguous or incomplete design environments.

Minimum Qualifications

• 7 years of experience in signal integrity and power integrity modeling and analysis.
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design.
• Hands‑on experience with industry‑standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight.

Preferred Qualifications

• 10+ years of experience in SI and PDN modeling and analysis.
• Experience with 2.5D/3D advanced packaging technologies such as interposer‑based designs.
• Background working with high‑bandwidth interfaces including HBM, DDR, SERDES, or UCIe.
• Direct ownership of system‑level SI/PI sign‑off for production silicon.
• Scripting experience with TCL and/or Python to automate SI/PI analysis flows.

Compensation

The estimated U.S. base salary range for this full‑time position is $175,000.00 – $309,000.00 per year. Additional compensation may include benefits, bonuses, and equity.

Benefits

Micron provides medical, dental, and vision plans, income protection programs, paid family leave, a robust paid time‑off program, and paid holidays. Additional benefit details are available in the Micron Benefits Guide.

Equal Opportunity Employer

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.