Senior SI/PI Engineer – Advanced 2.5D/3D Packaging

Annapurna Labs; San Diego (CA); On-site; USD 185,000 - 250,000; Full time

Job summary

Annapurna Labs, within Amazon, seeks a Sr. Signal & Power Integrity Engineer in San Diego to lead SI/PI analysis for advanced packaging tech (2.5D/3D). You’ll drive PDN optimization from die to board and work with ASIC, board, and packaging teams to meet performance and manufacturing targets.

You will use HFSS, Sigrity, and ADS for simulations, model interconnects, and validate designs with lab measurements, contributing to next‑gen ML/data center ASICs.

Qualifications

• Bachelor's degree in Electrical Engineering or a related field.
• 10+ years of experience in signal integrity, power integrity, and package design.
• Deep expertise in package SI/PI analysis: S-parameter extraction, PDN impedance analysis, IR drop, crosstalk, and return loss.
• Hands‑on experience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, or equivalent.
• Strong understanding of advanced packaging technologies: 2.5D/3D‑IC, silicon interposers, fan‑out wafer‑level packaging, RDL, TSVs, and microbump interconnects.
• Experience analyzing and modeling decoupling technologies including on‑die MOM/MOS capacitors, deep trench capacitors (DTCs), and IPD capacitors within the package PDN.
• Proficiency in stack‑up design and impedance control for multi‑layer organic substrates and silicon interposers.
• Hands‑on experience correlating package SI/PI simulations with lab measurements (TDR, VNA, oscilloscope)

Responsibilities

• Lead package‑level SI/PI analysis for 2.5D, 3D‑IC, fan‑out, and silicon interposer/bridge architectures.
• Design and optimize package stack‑ups: dielectric material selection, impedance control, layer assignment, and RDL routing for high‑speed and power delivery performance.
• Perform high‑speed channel simulations (S‑parameter extraction, time‑domain analysis, eye diagrams) for die‑to‑die and die‑to‑board interfaces through the package.
• Analyze and optimize the package PDN end‑to‑end: decoupling strategy, plane resonance, IR drop, and AC impedance from die bumps through substrate to board.
• Characterize and model on‑die capacitance, deep trench capacitors (DTCs), and integrated passive device (IPD) capacitors; evaluate their effectiveness within the full‑stack PDN impedance profile.
• Interface with SoC die‑level PDN teams to align power grid requirements, current profiles, and decoupling budgets across the chip‑package boundary.
• Perform 3D/2.5D EMIR analysis using tools such as Ansys RedHawk‑SC 3DIC, Cadence Voltus, or equivalent to validate IR drop and electromigration across multi‑die stacked packages.
• Model advanced interconnects: microbumps, C4 bumps, TSVs, microvias, PTH vias, and RDL traces for both signal and power paths.
• Apply equalization techniques (DFE, CTLE, FFE) and evaluate package‑level channel margins for PCIe, UCIe, and custom die‑to‑die links.
• Perform clock distribution and jitter analysis at the package level, accounting for coupling, skew, and return path discontinuities.
• Collaborate with ASIC design, board design, and packaging/assembly teams to co‑optimize package architecture for electrical performance and manufacturing yield.
• Identify and mitigate package manufacturing risks — warpage, via reliability, impedance variation, and material tolerance impacts on SI/PI.
• Develop and maintain package SI/PI modeling flows, automation scripts, and design guidelines.

Education

Bachelor's degree in Electrical Engineering or a related field

10+ years of experience in signal integrity, power integrity, and package design

Strong understanding of advanced packaging technologies: 2.5D/3D‑IC, silicon interposers, fan‑out wafer‑level packaging, RDL, TSVs, and microbump interconnects

Hands‑on experience correlating package SI/PI simulations with lab measurements (TDR, VNA, oscilloscope)

Tools

HFSS

Cadence Sigrity (PowerSI, PowerDC, Clarity)

ADS

Job description

Annapurna Labs, within Amazon, seeks a Sr. Signal & Power Integrity Engineer in San Diego to lead SI/PI analysis for advanced packaging tech (2.5D/3D). You’ll drive PDN optimization from die to board and work with ASIC, board, and packaging teams to meet performance and manufacturing targets.

You will use HFSS, Sigrity, and ADS for simulations, model interconnects, and validate designs with lab measurements, contributing to next‑gen ML/data center ASICs.