Senior SI/PI Engineer — AI Accelerator Packaging

Etched; San Jose (CA); On-site; USD 150,000 - 275,000; Full time

Benefits offered by this job

Medical, dental, and vision packages

Housing subsidy

Relocation support to San Jose

Daily meals in office

Unlimited compute budget

Job summary

Etched is seeking a Signal & Power Integrity Engineer to ensure the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate has extensive experience with high-power PDN, 2D/2.5D/3D packaging SI/PI, and collaboration with OSAT/ODM partners to push power delivery and signaling capabilities.

You will drive decoupling strategies, manage PDN targets, and work with silicon, package, and system teams to achieve best-in-class performance.

Qualifications

• 8+ years of SI/PI experience on high-performance ASIC or accelerator platforms.
• Proven experience defining and closing PDN for high-power silicon, including substrate and PCB plane design.
• Experience with high-speed interfaces like HBM, SerDes, and D2D.
• Hands-on with HFSS / SIwave, Cadence Sigrity (PowerSI/PowerDC), Keysight ADS.

Responsibilities

• SI/PI analysis and optimization of 2D/2.5D/3D packages.
• Coordinate with Package Layout, ASIC PD, and Board teams to optimize electrical performance.
• Drive PDN design and decoupling across substrate and interposer; manage DC IR drop and impedance targets.
• Own ball map / C4 / BGA pin assignments with cross-functional teams.
• Support board-level SI/PI and rack-scale topology studies; design test vehicle.
• Participate in cross-functional meetings and design reviews.

Skills

SI/PI experience

High-power PDN design

HBM / SerDes / D2D interfaces

HFSS / SIwave

PowerSI / PowerDC

Keysight ADS

Education

Bachelor's or Master's in Electrical/Computer Engineering

Tools

CoWoS packaging

Job description

Etched is seeking a Signal & Power Integrity Engineer to ensure the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate has extensive experience with high-power PDN, 2D/2.5D/3D packaging SI/PI, and collaboration with OSAT/ODM partners to push power delivery and signaling capabilities.

You will drive decoupling strategies, manage PDN targets, and work with silicon, package, and system teams to achieve best-in-class performance.