Chip Package SI/PI Engineer for AI Hardware

Google

United States

On-site

USD 192,000 - 278,000

Full time

14 days+

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Job summary

Google Sunnyvale, CA, seeks a Chip Package Signal and Power Integrity Engineer to advance SI/PI for advanced chip/package integration in AI/ML hardware. You will shape TPU packaging, work with ASIC/board/system teams, and drive SI/PI verification for production-grade silicon solutions.

In this role you will lead SI/PI analyses across 2.5D/3D packaging, develop methodologies, evaluate new packaging tech, and collaborate with design teams and vendors to meet electrical requirements for

Qualifications

Bachelor's degree or equivalent practical experience in EE/CE/CS or related field.
10 years of experience with SI/PI design for chip/package or system PCB.
Experience with SIPI modeling tool chains (HFSS, ADS, Sigrity, Siwave, etc.).

Responsibilities

Drive chip-package-system co-design by performing SI/PI analysis and optimization for HPC 2.5D/3D package tech.
Develop Power integrity methodology for advanced package technology and productivity improvements.
Evaluate new package technology and high-speed interface IP.
Collaborate with chip design, system design, and suppliers to drive SI/PI targets and trade-offs for production.
Provide feedback on chip floorplan considering package/system routability and SI/PI.