Principal RF SiP Packaging Engineer: Lead Innovation

Skyworks Solutions, Inc.

San Jose (CA)

Híbrido

USD 129 400 - 247 800

Tempo integral

14 dias+

Uma candidatura completa num minuto

Currículo e carta de apresentação personalizados, prontos a enviar.

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Vantagens oferecidas por esta oferta de emprego

Healthcare benefits
401(k) plan with company match
Employee stock purchase plan
Paid time off including parental leave

Resumo da oferta

A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.

Qualificações

  • Minimum 12 years experience in semiconductor packaging technology.
  • Strong project management and communication skills.
  • Expertise with overmolded laminate module packaging processes.

Responsabilidades

  • Define and implement the package requirements with IC design teams.
  • Ownership of product from feasibility stage to high volume production.
  • Develop new assembly technologies and run process DOE's.

Conhecimentos

Project management
Communication skills
Expertise in packaging processes

Formação académica

BS Degree in Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science

Ferramentas

Cadence Allegro platform
Mentor Xpedition platform

Descrição da oferta de emprego

A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.
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