Principal RF SiP Packaging Engineer: Lead Innovation

Skyworks Solutions, Inc.

San Jose (CA)

Hybrid

USD 129,400 - 247,800

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Healthcare benefits
401(k) plan with company match
Employee stock purchase plan
Paid time off including parental leave

Job summary

A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.

Qualifications

  • Minimum 12 years experience in semiconductor packaging technology.
  • Strong project management and communication skills.
  • Expertise with overmolded laminate module packaging processes.

Responsibilities

  • Define and implement the package requirements with IC design teams.
  • Ownership of product from feasibility stage to high volume production.
  • Develop new assembly technologies and run process DOE's.

Skills

Project management
Communication skills
Expertise in packaging processes

Education

BS Degree in Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science

Tools

Cadence Allegro platform
Mentor Xpedition platform

Job description

A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

SiP Process Engineer: Advanced Packaging & NPI
SiP Process Engineer: Advanced Packaging & NPI

Keysight Technologies • Santa Rosa (CA)

On-site
USD 126,930 - 211,550
Medical, dental and vision
Health Savings Account
401(k) Plan
+3
Senior Process Engineer - SiP & Advanced Packaging
Senior Process Engineer - SiP & Advanced Packaging

Keysight Technologies SAles Spain SL. • Santa Rosa (CA)

On-site
USD 126,930 - 211,550
Medical, dental and vision
401(k) Plan
Flexible Time Off
R&D RF IC/SiP Engineer - Lead New Product Introductions
R&D RF IC/SiP Engineer - Lead New Product Introductions

Keysight Technologies SAles Spain SL. • Santa Rosa (CA)

On-site
USD 114,000 - 192,000
Medical, dental and vision
401(k) Plan
Flexible Time Off
Senior IC Packaging Engineer – 2.5D & Automotive RFIC
Senior IC Packaging Engineer – 2.5D & Automotive RFIC

Vivid Technology • San Jose (CA)

Hybrid
USD 120,000 - 150,000
Principal Mechanical Engineer, RF Packaging & Thermal
Principal Mechanical Engineer, RF Packaging & Thermal

MACOM • Northampton (MA)

On-site
USD 100,000 - 130,000
Senior IC Packaging Engineer - SI & PI
Senior IC Packaging Engineer - SI & PI

Blue Origin • Van Horn (TX)

On-site
USD 230,000 - 323,000
Relocation provided
Travel up to 10%
Senior IC Packaging Engineer: RF/mmWave SI/PI Lead
Senior IC Packaging Engineer: RF/mmWave SI/PI Lead

Blue Origin • Central (TX)

On-site
USD 230,000 - 323,000
Relocation provided
Travel up to 10%
Senior Packaging Architect – 3D/SiP (Hybrid)
Senior Packaging Architect – 3D/SiP (Hybrid)

Renesas • San Jose (CA)

Hybrid
USD 200,000 - 240,000
Bonus opportunities
Senior IC Packaging Architect – SiP & Chiplet Leader
Senior IC Packaging Architect – SiP & Chiplet Leader

Axiado Corporation • San Jose (CA)

On-site
USD 120,000 - 160,000
Senior IC Packaging Architect: SiP & Chiplet Systems
Senior IC Packaging Architect: SiP & Chiplet Systems

Axiado • San Jose (CA)

On-site
USD 140,000 - 180,000