Principal RF SiP Packaging Engineer: Lead Innovation
Skyworks Solutions, Inc.
San Jose (CA)
Híbrido
USD 129 400 - 247 800
Tempo integral
14 dias+
Uma candidatura completa num minuto
Currículo e carta de apresentação personalizados, prontos a enviar.
Ultrapassa os filtros ATS
Vantagens oferecidas por esta oferta de emprego
Healthcare benefits
401(k) plan with company match
Employee stock purchase plan
Paid time off including parental leave
Resumo da oferta
A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.
Qualificações
Minimum 12 years experience in semiconductor packaging technology.
Strong project management and communication skills.
Expertise with overmolded laminate module packaging processes.
Responsabilidades
Define and implement the package requirements with IC design teams.
Ownership of product from feasibility stage to high volume production.
Develop new assembly technologies and run process DOE's.
Conhecimentos
Project management
Communication skills
Expertise in packaging processes
Formação académica
BS Degree in Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science
Ferramentas
Cadence Allegro platform
Mentor Xpedition platform
Descrição da oferta de emprego
A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.
Obtém a tua avaliação gratuita e confidencial do currículo.
Estava farto de enviar currículos sem obter resposta até usar a JobLeads. Fizeram com que fosse impossível aos recrutadores ficarem indiferentes ao meu currículo.
Sophie Reynolds
A avaliação de currículo da JobLeads ajudou-me a corrigir erros críticos e comecei a receber convites para entrevistas quase imediatamente!
Daniel Fischer
Com a avaliação de currículo da JobLeads, o meu currículo deixou de ser ignorado e passou a conseguir-me entrevistas de emprego em menos de nada!