Principal RF SiP Packaging Engineer: Lead Innovation
Skyworks Solutions, Inc.
San Jose (CA)
Hybrid
USD 129,400 - 247,800
Full time
14 days+
Get more replies from employers
Send a job-specific resume in minutes.
Start fresh or import an existing resume
Benefits offered by this job
Healthcare benefits
401(k) plan with company match
Employee stock purchase plan
Paid time off including parental leave
Job summary
A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.
Qualifications
Minimum 12 years experience in semiconductor packaging technology.
Strong project management and communication skills.
Expertise with overmolded laminate module packaging processes.
Responsibilities
Define and implement the package requirements with IC design teams.
Ownership of product from feasibility stage to high volume production.
Develop new assembly technologies and run process DOE's.
Skills
Project management
Communication skills
Expertise in packaging processes
Education
BS Degree in Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science
Tools
Cadence Allegro platform
Mentor Xpedition platform
Job description
A leader in analog semiconductors is seeking a Principal Packaging Engineer in San Jose, CA, to support new product development of RF System in Package (SiP) modules. The role involves defining package requirements, owning product development from feasibility to production, and leading strategic packaging initiatives. The ideal candidate should have extensive experience in semiconductor packaging technologies and a strong project management background. This position offers a competitive salary and benefits, fostering an environment for meaningful contributions and global collaboration.