Senior Physical Verification Engineer, ASIC (3nm/2nm)

Broadcom Inc.

San Jose (CA)

On-site

USD 144,000 - 230,000

Full time

6 days ago
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Benefits offered by this job

Discretionary annual bonus
Equity grants
Medical, dental and vision plans
401(K) with company matching
ESPP
Paid holidays

Job summary

Broadcom's APD division seeks a Principal Physical Design Engineer to lead chip-level physical design and verification for advanced ASICs. This role requires hands-on verification, deep PD knowledge, and on-site collaboration at the San Jose campus.

You will work on 3nm/2nm nodes, drive floorplanning, DRC/LVS/PERC, and provide scripting-based flow improvements, with strong communication across teams.

Qualifications

  • Bachelor's degree in Electrical or Electronics Engineering
  • 12+ years of relevant experience in ASIC physical design
  • Hands-on physical verification experience (LVS, DRC, ERC, PERC)
  • Experience with 3nm/2nm nodes and chip integration
  • Must work in San Jose site; on-site only
  • Strong scripting (Python, Tcl, or Perl)

Responsibilities

  • Execute chip-level physical verification and resolve issues
  • Set up DRM runsets for advanced nodes and tool flows
  • Manage rules for top-level floorplan, I/O and bump planning
  • Resolve physical design issues related to chip integration and assembly
  • Provide technical direction on verification methodologies (DRC/LVS/ERC/PERC)
  • Develop best-practice guidelines for verification flows and optimizations

Skills

Physical verification
LVS DRC ERC PERC
EDA tools
Calibre Pegasus ICV
Python scripting
Top-level floorplan
Communication
On-site only
Tape-out experience
Density & Fill

Education

Bachelor's degree in Electrical or Electronics Engineering

Tools

Calibre
Pegasus
ICV

Job description

Broadcom's APD division seeks a Principal Physical Design Engineer to lead chip-level physical design and verification for advanced ASICs. This role requires hands-on verification, deep PD knowledge, and on-site collaboration at the San Jose campus.

You will work on 3nm/2nm nodes, drive floorplanning, DRC/LVS/PERC, and provide scripting-based flow improvements, with strong communication across teams.

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