Senior Physical Design Engineer

Broadcom Inc.; San Jose (CA); On-site; USD 122,000 - 195,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

401K with match

ESPP

EAP

Paid time off

Job summary

Broadcom Inc. in San Jose seeks a Senior Physical Design Engineer to drive RTL-to-silicon tape-out across 5nm to 2nm nodes.

You will lead block- and top-level implementation, timing/power closure, and signoff using Cadence Innovus and industry-standard tools. You will collaborate with global teams on AI and PCIe switch products, bringing deep expertise in high-speed clock networks, UPF/CPF flows, and power-aware design.

Qualifications

• 8+ years of hands-on physical design experience tape-out of high-frequency ASICs.
• Deep sub-micron experience in TSMC N7/N5/N3 or equivalent.
• Proficient with major PD tool flows: P&R, STA, extraction, IR/EM, DRC/LVS.

Responsibilities

• Lead block/top-level implementation from floorplanning to GDSII stream-out using Innovus.
• Drive floorplanning, placement, CTS, routing, and timing/power optimization on advanced nodes.
• Perform MCMM STA, SI optimization, and power-grid/IR-EM signoff.

Skills

Technical leadership

Problem solving

Cross-functional communication

TCL scripting

Python scripting

Unix shell scripting

Electrical engineering background

Education

B.S./M.S. in Electrical/Computer Engineering

Tools

Cadence Innovus

Synopsys PrimeTime

Cadence Tempus

StarRC

QRC

Calibre

RedHawk

Job description

Who We Are — Physical Design Team in APD Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper‑scale cloud providers, AI pioneers, and tier‑1 networking infrastructure leaders to co‑design and manufacture complex, custom ASICs that power the modern digital backbone. The Physical Design team within APD is the world‑class execution engine behind the industry’s most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting edge physical design methodologies in 3nm/2nm nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra‑complex architecture into fully realized, high‑yielding, first‑pass silicon success.

Broadcom is searching for an Senior Physical Design Engineer to join the ASIC Products Division. This position involves working with the latest technology to continue driving next generation Artificial Intelligence and PCIe Switch Products. More specifically, this position will require in‑depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape‑out.

Key Responsibilities

• Full-Flow Implementation: Lead block-level and top-level implementation from floorplanning to GDSII stream‑out using Cadence Innovus
• Advanced Node Execution: Drive floorplanning, placement, CTS, routing, and timing/power optimization on advanced technology nodes (5nm, 3nm, 2nm) using multi‑patterning and complex metal stacks.
• Timing & Power Closure: Perform multi‑corner multi‑mode (MCMM) static timing analysis (STA), signal integrity (SI) optimization, and power grid optimization (static/dynamic IR‑drop, EM) for signoff using PrimeTime, Voltus, or RedHawk.

Qualifications & Requirements

• Education: B.S. or M.S. degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Experience: 8+ years of hands‑on physical design experience successfully taping out complex high‑frequency, ultra‑large‑scale networking or AI ASICs.
• Deep Sub‑Micron Expertise: Direct experience executing tape‑outs in TSMC advanced nodes (N7, N5, N3) or equivalent foundry processes.
• EDA Tool Mastery: High proficiency in major physical design tool flows: P&R: Cadence Innovus Timing/STA: Synopsys PrimeTime or Cadence Tempus Extraction & IR/EM: StarRC / QRC, RedHawk DRC/LVS: Siemens Calibre
• Automation Skills: Advanced TCL, Python, and Unix shell scripting for flow automation and database manipulation.
• Communication: Excellent technical leadership, problem‑solving, and cross‑functional communication skills.
• Preferred Qualifications: Strong background in high‑speed clock network implementation (H-tree, mesh, low‑power CTS). Experience with power‑aware implementation flows (UPF/CPF, multi‑voltage domains, clock/power gating).

Compensation and Benefits

The annual base salary range for this position is USD 121,900.00 To USD 195,000.00 As a valued member of our team, you’ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company’s growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.