Senior Packaging Module Engineer – Dielectrics & DOE

Able Too Work; Phoenix, Northern (AZ, KY); Hybrid; USD 134,000 - 220,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel is seeking a Packaging Module Development Engineer in the US (Phoenix, AZ) to advance assembly and packaging technologies. You will develop processes, equipment, and materials to enable next-generation packaging solutions, impacting manufacturing efficiency and product quality.

The role involves leading experiments, collaborating across teams, and driving continuous improvement to scale capabilities while meeting product development schedules.

Qualifications

• DOE proficiency and statistical data analysis are required.
• Experience in semiconductor or packaging processing is essential.

Responsibilities

• Identify early-stage reliability issues and develop solutions in packaging technology.
• Optimize equipment configurations, process specs, and integration flows for advanced packaging.
• Collaborate with cross-functional teams to design and run experiments evaluating process/material interactions.
• Lead continuous improvement to enhance process capability, stability, productivity, automation, yield, and manufacturability.
• Establish material specifications and coordinate with supplier quality to ensure dielectric materials meet requirements.
• Apply DOE principles to characterize processes and improve performance.
• Develop next-generation patternable dielectric materials and fabrication processes for scalable packaging.
• Manage projects to align with product development schedules and milestones.
• Respond promptly to foundry customer requests, escalations, and manufacturing events.
• Document advancements through papers and enable knowledge sharing.

Skills

DOE

Statistical analysis

Process control

Semiconductor packaging

Technical leadership

Independent work

Education

Bachelor's in Materials Science/Engineering

Master's in related field

PhD in related field

Tools

DOE software

Lamination & coat/bake

Job description

Intel is seeking a Packaging Module Development Engineer in the US (Phoenix, AZ) to advance assembly and packaging technologies. You will develop processes, equipment, and materials to enable next-generation packaging solutions, impacting manufacturing efficiency and product quality.

The role involves leading experiments, collaborating across teams, and driving continuous improvement to scale capabilities while meeting product development schedules.