Packaging Equipment Development Group Lead

Intel Corporation; Phoenix (AZ); On-site; USD 181,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health insurance

Retirement savings plan

Vacation

Job summary

Intel Corporation is seeking a Packaging Equipment Development Manager to lead innovation in semiconductor packaging, oversee new equipment introductions, and drive seamless integration with manufacturing. The role sits within Assembly Technology Development, contributing to Intel's advanced packaging roadmap and high-volume production capabilities.

The position emphasizes leadership, strategic decision-making, and collaboration with internal and external partners to deliver cutting-edge

Qualifications

• Bachelor's degree with 9+ years of relevant experience.
• Master's degree with 6+ years of relevant experience.
• PhD with 4+ years of relevant experience.
• Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Proficiency in statistical methods, experimental design, and data analysis.

Responsibilities

• Lead a team responsible for equipment development and semiconductor packaging solutions.
• Drive first-of-a-kind equipment introduction and smooth transition to high-volume manufacturing.
• Manage strategic and tactical decisions for module engineering activities.
• Collaborate with manufacturing, suppliers, and process integration teams to optimize equipment and processes.

Skills

Equipment development

Process integration

People management

Statistical methods

Education

Bachelor's degree in related field (Materials Science, Mechanical, Physics, Electrical, Chemical)

Master's degree in above fields

PhD in above fields

Job description

Job Details: Job Description: As a Packaging Equipment Development Manager, you will drive innovation and excellence in semiconductor packaging processes, equipment and technologies within Intel's dynamic assembly environment. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions. Your leadership will directly impact Intel's ability to deliver cutting-edge products to customers, shaping the future of semiconductor technology. You will be part of Intel's Assembly Technology Development (ATD) organization, which plays a pivotal role in advancing assembly capabilities. This group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. By joining this team, you will contribute to Intel's mission of delivering transformative technologies that fuel global progress.

Key Responsibilities

• Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.
• Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM).
• Manage strategic and tactical decision-making for module engineering activities, ensuring alignment with Intel's operational goals.
• Collaborate with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges.
• Develop long-term strategies for equipment capabilities to support future requirements.
• Provide mentorship to engineers, fostering technical expertise and leadership within the team.
• Ensure team accountability and drive results through effective goal setting, performance management, and collaboration.
• Champion Intel's values, creating an inclusive and productive work environment.

Qualifications

Minimum Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or a related field, with 9+ years of relevant experience.
• OR- Master's degree in the above fields with 6+ years of relevant experience.
• OR- PhD degree in the above fields with 4+ years of relevant experience.
• Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Proficiency in statistical methods, experimental design, and data analysis.

Preferred Qualifications

• 5+ years of semiconductor assembly process technology development experience.
• 3+ years of people management experience, including mentoring and team leadership.
• Expertise in dispense, thermal, plasma equipment development, or related fields.
• Strong problem-solving skills and familiarity with assembly equipment development methodologies.
  • Ability to create and execute equipment solution roadmaps, guiding external suppliers to develop industry-leading technologies.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

This role will require an on-site presence.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.

We do not charge any fees during our hiring process.

Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.

If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.