Packaging Equipment Development Group Lead

Intel Corporation; Chandler (AZ); On-site; USD 181,000 - 255,000; Full time

Job summary

Intel Corporation in Chandler, Arizona is seeking an experienced Packaging Equipment Development Manager to drive innovation in semiconductor packaging processes and equipment within our assembly environment. You will lead a team responsible for new equipment introductions, oversee development and integration with manufacturing, and mentor engineers to deliver world-class manufacturing solutions.

This role sits in Intel's Assembly Technology Development organization and requires on-site work in

Qualifications

• Minimum qualifications include a Bachelor’s degree in a related engineering field with 9+ years of experience, or a Master’s with 6+, or a PhD with 4+ years.
• Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Proficiency in statistical methods, experimental design, and data analysis.
• 3+ years of people management experience, including mentoring and team leadership.

Responsibilities

• Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.
• Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM).
• Manage strategic and tactical decision‑making for module engineering activities, ensuring alignment with Intel's operational goals.
• Collaborate with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges.
• Develop long‑term strategies for equipment capabilities to support future requirements.
• Provide mentorship to engineers, fostering technical expertise and leadership within the team.
• Ensure team accountability and drive results through effective goal setting, performance management, and collaboration.
• Champion Intel's values, creating an inclusive and productive work environment.

Skills

Statistical methods

Experimental design

Data analysis

Problem-solving

Team leadership

Education

Bachelor’s degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or related field

Master’s degree in the above fields

PhD in the above fields

Tools

Dispense equipment development

Thermal equipment development

Plasma equipment development

Job description

Job Details: Job Description: As a Packaging Equipment Development Manager, you will drive innovation and excellence in semiconductor packaging processes, equipment and technologies within Intel's dynamic assembly environment.

In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions.

Your leadership will directly impact Intel's ability to deliver cutting-edge products to customers, shaping the future of semiconductor technology.

You will be part of Intel's Assembly Technology Development (ATD) organization, which plays a pivotal role in advancing assembly capabilities. This group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production.

By joining this team, you will contribute to Intel's mission of delivering transformative technologies that fuel global progress

Key Responsibilities

• Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.
• Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM).
• Manage strategic and tactical decision‑making for module engineering activities, ensuring alignment with Intel's operational goals.
• Collaborate with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges.
• Develop long‑term strategies for equipment capabilities to support future requirements.
• Provide mentorship to engineers, fostering technical expertise and leadership within the team.
• Ensure team accountability and drive results through effective goal setting, performance management, and collaboration.
• Champion Intel's values, creating an inclusive and productive work environment.

Qualifications

• Minimum Qualifications Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or a related field, with 9+ years of relevant experience.
• OR- Master's degree in the above fields with 6+ years of relevant experience.
• OR- PhD degree in the above fields with 4+ years of relevant experience.
• Demonstrated experience in equipment development and process integration for semiconductor packaging.
• Proficiency in statistical methods, experimental design, and data analysis.
• Preferred Qualifications 5+ years of semiconductor assembly process technology development experience.
• 3+ years of people management experience, including mentoring and team leadership.
• Expertise in dispense, thermal, plasma equipment development, or related fields.
• Strong problem‑solving skills and familiarity with assembly equipment development methodologies.
• Ability to create and execute equipment solution roadmaps, guiding external suppliers to develop industry‑leading technologies.

Join our innovative team and play a key role in developing cutting-edge solutions that drive the future of semiconductor technology. Your expertise and leadership will help Intel deliver world-class products that shape our industry.

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Position of Trust N/A

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence.

* Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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