Senior Packaging Engineer - AI Accelerator Tech

Annapurna Labs; Tempe (AZ); On-site; USD 185,000 - 250,000; Full time

Job summary

Annapurna Labs, located in Tempe, Arizona, is seeking a senior Package Technology Development professional to lead development across architecture, materials, processes and reliability for next‑gen Trainium systems. The role collaborates with design, manufacturing, supply chain and OSAT partners to drive volume production.

The ideal candidate has deep experience in substrate/PCB, interposer technology, and package/board assembly, with a track record of advancing technology from concept to

Qualifications

• Experience coordinating between technical teams, peers and business stakeholders.
• Bachelor's in Materials Science, Mechanical/Electrical/Chemical Engineering, or related field.
• Expertise in substrate/PCB technology, interposer technology, or package and board assembly technology.

Responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system‑level integration for next‑generation Trainium systems.
• Partner with OSATs and suppliers on capability validation, test vehicle development, qualification, risk retirement, root‑cause analysis, and corrective/preventive actions.
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide decisions.
• Represent the package technology team in cross‑functional design reviews, sign‑offs, and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost and accelerate time‑to‑market.

Skills

Stakeholder coordination

Cross-functional collaboration

Technical packaging knowledge

PCB/Interposer knowledge

Education

Bachelor's in Materials Science or related field

8+ years industrial experience (related field)

Tools

HDI technology

CoWoS interposer

DFM for advanced systems

Job description

Annapurna Labs, located in Tempe, Arizona, is seeking a senior Package Technology Development professional to lead development across architecture, materials, processes and reliability for next‑gen Trainium systems. The role collaborates with design, manufacturing, supply chain and OSAT partners to drive volume production.

The ideal candidate has deep experience in substrate/PCB, interposer technology, and package/board assembly, with a track record of advancing technology from concept to