AI Packaging Engineer - Next-Gen Trainium Systems

Annapurna Labs; Tempe (AZ); On-site; USD 154,000 - 215,000; Full time

Benefits offered by this job

RSU and bonus programs

Comprehensive health benefits

Job summary

Annapurna Labs (U.S.) Inc. in Tempe, AZ is seeking a Package Technology Engineer to drive next-generation trainium packaging efforts.

You will work across architecture, materials, and manufacturing to ensure reliable, cost-efficient solutions for advanced AI accelerators. The role collaborates with OSATs, suppliers, and internal teams to validate capabilities, perform risk analysis, and guide qualification from concept to volume production.

Qualifications

• Experience coordinating between technical teams, peers and business stakeholders.

Responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production.
• Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies.
• Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market.

Skills

Project coordination

Stakeholder management

Cross-functional collaboration

Technical driving

Education

Bachelor's in Materials Science or Engineering

6+ years industry experience

Master's or PhD (preferred)

Job description

Annapurna Labs (U.S.) Inc. in Tempe, AZ is seeking a Package Technology Engineer to drive next-generation trainium packaging efforts.

You will work across architecture, materials, and manufacturing to ensure reliable, cost-efficient solutions for advanced AI accelerators. The role collaborates with OSATs, suppliers, and internal teams to validate capabilities, perform risk analysis, and guide qualification from concept to volume production.