Package Thermal Modeling Architect for SoC & Board Systems

Advanced Micro Devices; Austin, Northern (TX, KY); Hybrid; USD 140,000 - 190,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

AMD is seeking an Advanced Package Thermal Technologist in Austin, TX. You will lead model-based architecture and drive thermal modeling across SoC, package, and board levels to optimize advanced packaging solutions.

The role requires a strong background in thermal and multi-physics modeling, PCB technologies, and experience aligning modeling with real-world validation. This is a senior, autonomous technical leadership position within a data center/HPC context.

Qualifications

• Demonstrated experience owning model-based architecture & design decisions across SoC, package & system.
• Strong foundation in Thermal and CFD first-principles understanding for multi-physics design.
• Experience with advanced PCB technologies including materials, designs & assembly constraints.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) with validation strategies for STCO.
• Engage with suppliers, partners and vendors to align material properties and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for thermal and package technology development, assess readiness, influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with focus on data center platforms.

Skills

Thermal modeling

Model-based architecture

CFD fundamentals

System-level design

PCB technologies

DOE design/experiments

AI/ML workflows in engineering

Data center/HPC domain

Education

MS/PhD in Engineering or Physics

Job description

AMD is seeking an Advanced Package Thermal Technologist in Austin, TX. You will lead model-based architecture and drive thermal modeling across SoC, package, and board levels to optimize advanced packaging solutions.

The role requires a strong background in thermal and multi-physics modeling, PCB technologies, and experience aligning modeling with real-world validation. This is a senior, autonomous technical leadership position within a data center/HPC context.