Packaging Architect: Multi-Physics & STCO Leader

AMD; United States; On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

AMD benefits

Job summary

AMD is seeking a Package-centric Mechanical Modeling Architect in Austin, TX. You will define architectures using model-based decisions, guiding package/board-level design and STCO across silicon, package, board and platform.

The ideal candidate leads with autonomy, partners across mechanical, thermal, optical and manufacturing teams, and influences roadmaps for data center platforms with a deep background in PCB tech, FEA, and multi-physics modeling.

Qualifications

• Model-based architecture & design decisions for advanced package technologies.
• Strong background in PCB technologies, high-layer-count designs and warpage control.
• Solid foundation in Mechanics, Fracture, Materials, Design & FEA with physics-based trade-offs.
• Experience guiding SMT processes, connectors and mechanical assembly strategies.
• Experience integrating electro-thermal and electro-optical technologies with modeling.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
• Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies with labs to enable STCO.
• Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes and tolerances.
• Engage with PCB suppliers, EMS partners, and vendors to align material properties and modeling assumptions.
• Define targets and strategic direction for mechanical and package technology development and influence product roadmaps.
• Serve as a mechanical & multi-physics SME for package and board-level architectures with a focus on data center platforms.

Skills

Model-based architecture

Mechanical & multi-physics modeling

FEA

Materials knowledge

Design & analysis

Education

MS or PhD in Engineering or Physics

Job description

AMD is seeking a Package-centric Mechanical Modeling Architect in Austin, TX. You will define architectures using model-based decisions, guiding package/board-level design and STCO across silicon, package, board and platform.

The ideal candidate leads with autonomy, partners across mechanical, thermal, optical and manufacturing teams, and influences roadmaps for data center platforms with a deep background in PCB tech, FEA, and multi-physics modeling.