Senior Package Silicon Integration Engineer (AI-Enabled)

Micron Technology; Boise (ID); On-site; USD 110,000 - 170,000; Full time

Benefits offered by this job

Medical, dental & vision plans

Paid time off

Paid holidays

Wellbeing programs

Job summary

Micron Technology in Idaho is seeking a Package Development Engineer to lead CPI packaging integration, guiding cross-functional teams and delivering robust design rules and roadmaps.

You will monitor CPI health, support test vehicle development, and apply AI-enabled tools to enhance productivity and data-driven decisions. This role focuses on silicon/package health across the product lifecycle in a fast-paced environment.

Qualifications

• Bachelor’s or higher in Materials, Mechanical, Chemical, or Electrical Engineering.
• 5+ years of relevant industry experience.
• Experience with chip package interactions and 1st level chip interconnect reliability.
• Experience with component package materials and BOM selection.
• Excellent communication skills to convey technical concepts to diverse partners.

Responsibilities

• Develop systems to monitor End-to-End CPI health with internal teams and AI capability.
• Lead CPI package design rules in the design rule systems for flip chip, wire bond, and 3DS packages.
• Create and maintain technology roadmaps and present as needed.
• Support CPI test vehicle development and reliability characterization efforts.
• Collaborate across CPI engineering, package design, Fab BEOL, development product engineering, and quality to identify NUDDs and mitigation strategies.
• Create AI agents and compiling summaries from diverse data sources.

Skills

Technical problem solving

Cross-functional collaboration

Communication skills

Education

Engineering degree

Job description

Micron Technology in Idaho is seeking a Package Development Engineer to lead CPI packaging integration, guiding cross-functional teams and delivering robust design rules and roadmaps.

You will monitor CPI health, support test vehicle development, and apply AI-enabled tools to enhance productivity and data-driven decisions. This role focuses on silicon/package health across the product lifecycle in a fast-paced environment.