Junior IC Package Layout Engineer - AI-Driven Design

Micron Technology; Boise (ID); On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time‑off

Paid holidays

Job summary

Micron Technology in Boise, Idaho, invites applications for an early‑career IC Package Layout Engineer. You will grow technical skills while contributing to the invention and implementation of advanced semiconductor packages used in Micron memory and storage products.

You will work with experienced engineers on package layout design, design verification, and manufacturing processes, collaborating across Package Design, SI, Product Engineering, Assembly and CAD teams to deliver quality solutions.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related engineering field.
• Graduation within the last 12 months or expected graduation prior to start date.
• Strong analytical and problem‑solving skills.
• Strong verbal and written communication skills.
• Ability to work effectively in a collaborative, cross‑functional environment.

Responsibilities

• Develop IC package layouts for DDR, LPDDR, GDDR, NAND, and ASIC products.
• Support feasibility studies, mechanical substrate layouts, and package design activities.
• Create and maintain PCB and IC Package Libraries (footprint creation) and execute package layout processes following established methodologies.
• Participate in layout reviews with cross‑functional engineering teams and generate layout documentation and drawings.
• Perform DRC checks and use validation tools to ensure design quality and manufacturability.
• Collaborate with Package Design, SI, Product Engineering, Assembly and CAD teams to deliver quality products.
• Support continuous improvement and design automation initiatives.
• Utilize AI‑enabled tools and data‑driven workflows to improve productivity and decision making.

Skills

Analytical thinking

Verbal & written communication

Collaborative teamwork

Python scripting

CAD/EDA tools

Education

Bachelor's or Master's degree in Electrical/Computer/Mechanical Engineering or related field

Graduation within last 12 months or before start date

Tools

CAD/EDA tools

Job description

Micron Technology in Boise, Idaho, invites applications for an early‑career IC Package Layout Engineer. You will grow technical skills while contributing to the invention and implementation of advanced semiconductor packages used in Micron memory and storage products.

You will work with experienced engineers on package layout design, design verification, and manufacturing processes, collaborating across Package Design, SI, Product Engineering, Assembly and CAD teams to deliver quality solutions.