Principal Package Silicon Integration Lead

Micron Technology, Inc; Boise (ID); On-site; USD 150,000 - 190,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Job summary

Micron Technology, Inc. in Boise invites a Principal Engineer to drive silicon and package integration strategies within the Package Development Engineering team.

You will partner with global engineering groups to deliver high-quality, innovative products across CPI, design, and BEOL interfaces. The role emphasizes developing technical roadmaps, maintaining CPI guidelines, evaluating reliability and electrical validation plans, and monitoring silicon integration health throughout the lifecycle,

Qualifications

• Bachelor’s degree or higher in Materials, Mechanical, Chemical, or Electrical Engineering.
• 5+ years of relevant industry experience.
• Experience with chip package interactions and 1st level chip interconnect reliability.
• Experience with component package materials & BOM selection and package assembly.
• Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.

Responsibilities

• Develop systems/methods for monitoring E2E CPI health, collaborating with internal teams and using capability of AI tools.
• Lead CPI package design rules in the package design rule management system and maintain design rule manuals for flip chip, wire bond, and 3DS packages.
• Create and maintain technology roadmaps and present as needed.
• Support CPI test vehicle development and reliability characterization efforts as needed.
• Collaborate with CPI engineering, package design, Fab BEOL process integration, development product engineering, and global quality to identify NUDDs and potential failure mechanisms, provide CPI risk assessments, and provide CPI risk mitigation solutions.
• Create AI agents and compiling summaries from diverse data sources

Skills

Chip package interactions

AI-enabled tools usage

Cross-functional collaboration

Technical communication

Education

Bachelor’s degree or higher in Materials, Mechanical, Chemical, or Electrical Engineering

Tools

Package Design Rule Management System

Reliability testing methods

Job description

Micron Technology, Inc. in Boise invites a Principal Engineer to drive silicon and package integration strategies within the Package Development Engineering team.

You will partner with global engineering groups to deliver high-quality, innovative products across CPI, design, and BEOL interfaces. The role emphasizes developing technical roadmaps, maintaining CPI guidelines, evaluating reliability and electrical validation plans, and monitoring silicon integration health throughout the lifecycle,