Package Architecture Analyst

Jobtailor; Arizona; On-site; USD 120,000 - 190,000; Full time

Job summary

Jobtailor is seeking a Senior Semiconductor Packaging Architect to translate requirements into detailed package architectures and lead trade-offs across electrical, mechanical, and thermal domains.

You will collaborate with silicon, hardware, and manufacturing teams to deliver robust, manufacturable packaging solutions and oversee development, processes, and documentation while driving quality improvements and production readiness.

Qualifications

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field with 9+ years of hands-on experience.
• Master's degree in a relevant field with 6+ years of hands-on experience, OR a PhD in a relevant field with 4+ years of hands-on experience.
• 4+ years of experience defining semiconductor/electronic package architectures and developing technical documentation.
• Experience applying Design for Manufacturing (DFM) principles.
• Experience utilizing Design of Experiments (DOE) methodologies.
• Experience troubleshooting package design and manufacturing issues.
• Advanced understanding of semiconductor packaging technologies and industry trends.
• Experience leading cross-disciplinary teams in a technical environment.
• Excellent analytical, communication, and problem-solving skills.
• Ability to collaborate cross-functionally with silicon, hardware, and manufacturing teams.

Responsibilities

• Translate product requirements into detailed package architecture specifications.
• Lead technology trade-off decisions across electrical, mechanical, thermal, and reliability requirements.
• Collaborate with silicon, hardware, and package leads to deliver outputs and address roadblocks.
• Oversee packaging development, including designs, processes, and procedures.
• Drive continuous improvement in packaging quality standards.
• Troubleshoot package designs and resolve technical issues.
• Deliver innovative, cost-effective packaging solutions.
• Partner with manufacturing teams on design-to-production transitions and tape-out readiness.
• Apply Design for Manufacturing principles to optimize manufacturability and production efficiency.
• Maintain and refine technical documentation for package development processes.

Skills

Semiconductor packaging architecture

Design for Manufacturing (DFM)

Design of Experiments (DOE)

Technical documentation development

Cross-disciplinary team leadership

Troubleshooting packaging design

Manufacturing transition

Analytical problem-solving

Packaging development

Mechanical engineering

Education

Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field with 9+ years

Master's degree in a relevant field with 6+ years

PhD in a relevant field with 4+ years

Job description

• Translate product requirements into detailed package architecture specifications


• Lead technology trade-off decisions across electrical, mechanical, thermal, and reliability requirements


• Collaborate with silicon, hardware, and package leads to deliver package outputs and address roadblocks


• Oversee packaging development, including designs, processes, and procedures


• Drive continuous improvement in packaging quality standards


• Troubleshoot package designs and resolve technical issues


• Deliver innovative, cost-effective packaging solutions


• Partner with manufacturing teams on design-to-production transitions and tape-out readiness


• Apply Design for Manufacturing principles to optimize manufacturability and production efficiency


• Maintain and refine technical documentation for package development processes

Requirements

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field with 9+ years of hands-on experience, OR a Master's degree in a relevant field with 6+ years of hands-on experience, OR a PhD in a relevant field with 4+ years of hands-on experience


• 4+ years of experience defining semiconductor/electronic package architectures and developing technical documentation


• Experience applying Design for Manufacturing (DFM) principles


• Experience utilizing Design of Experiments (DOE) methodologies


• Experience troubleshooting package design and manufacturing issues


• Advanced understanding of semiconductor packaging technologies and industry trends


• Experience leading cross-disciplinary teams in a technical environment


• Excellent analytical, communication, and problem-solving skills


• Ability to collaborate cross-functionally with silicon, hardware, and manufacturing teams

Core Competencies

Demonstrates expertise in semiconductor packaging technologies and Design for Manufacturing principles, with a strong focus on delivering innovative packaging solutions and optimizing production efficiency. Proven ability to lead cross-disciplinary teams and troubleshoot complex design and manufacturing issues.

Highest-signal resume keywords

• Semiconductor Packaging Architecture


• Design for Manufacturing (DFM)


• Design of Experiments (DOE)


• Technical Documentation Development


• Cross-Disciplinary Team Leadership

Hard Skills

• Mechanical Engineering


• Electrical Engineering


• Materials Science


• Packaging Development


• Troubleshooting Package Design


• Continuous Improvement


• Cost-Effective Packaging Solutions


• Manufacturing Transition


• Technical Documentation


• Analytical Problem-Solving

Soft Skills

• Excellent Communication


• Collaboration


• Analytical Skills

Industry Keywords

• Semiconductor Packaging Technologies


• Manufacturing Efficiency


• Technical Environment


• Industry Trends


• Cross-Functional Collaboration