Senior MMIC Packaging Engineer - Lead & Optimize

Mini--circuit; Carlsbad (CA); On-site; USD 130,000 - 165,000; Full time

Job summary

Mini-Circuits seeks a Senior Packaging Engineer to lead packaging development for MMIC, guiding concepts through release-to-market. You will work with Quality, CAD and external houses to drive packaging innovation and ensure best performance and manufacturability.

Ideal candidates bring 7+ years of engineering experience with semiconductor packaging, strong CAD skills, and a track record of improving yields and reducing costs.

Qualifications

• BSME with 7+ years in engineering, with 3+ years in semiconductor packaging.
• MSME or equivalent is preferred.
• Experience in microwave/millimeter-wave packaging and related processes.

Responsibilities

• Lead design of manufacturable package assembly drawings with MMIC/design engineers.
• Lead MMIC assembly discussions with internal and external packaging houses.
• Maintain and create package designs: laminate, leadframe, overmold, air cavity.
• Develop new materials and packaging platforms with factories.
• Design tooling/fixturing to facilitate assembly and manufacturing.
• Improve manufacturing techniques with new epoxies and interconnect methods.
• Perform design reviews and optimize for performance, quality, and yields.
• Collaborate to reduce manufacturing cost and improve yields.
• Ensure documentation controls and archive design files.
• Assist in qualification of contract manufacturers and FA activities.

Skills

MMIC packaging

Packaging development

CAD software

Wedge bonding

Problem solving

Education

BSME

MSME preferred

Tools

AutoCAD

Inventor

SolidWorks

DraftSight

Job description

Mini-Circuits seeks a Senior Packaging Engineer to lead packaging development for MMIC, guiding concepts through release-to-market. You will work with Quality, CAD and external houses to drive packaging innovation and ensure best performance and manufacturability.

Ideal candidates bring 7+ years of engineering experience with semiconductor packaging, strong CAD skills, and a track record of improving yields and reducing costs.