Senior Director, MEMS Packaging & Innovation

SiTime; Santa Clara (CA); On-site; USD 239,000 - 342,000; Full time

Job summary

SiTime seeks a seasoned packaging leader to drive its co-packaged MEMS strategy and execution. You will lead a cross-functional team spanning materials, mechanical design, and OSAT partners to deliver robust, scalable packaging solutions.

The role requires strong leadership, 10+ years in semiconductor packaging R&D and experience with advanced heterogeneous integration. A track record of global team leadership and collaboration with foundries is essential.

Qualifications

• Ph.D. or Master’s degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
• 10+ years of semiconductor packaging R&D experience with 5+ years leading teams.
• Expertise in semiconductor materials, process integration and metrology.
• Experience collaborating with OSATs and foundries.

Responsibilities

• Define packaging roadmap and architecture to meet performance, form-factor and cost targets.
• Lead OSAT development and manage local teams at key sites to accelerate development velocity.
• Oversee mechanical design, thermal performance and package reliability analyses.
• Collaborate with IC design teams to optimize parasitics and signal integrity.
• Drive material qualification, substrate selection and mold compound characterization.
• Advance workflows and KPIs for package development and lifecycle management.
• Develop leadership and talent within high-performance engineering teams.

Skills

Leadership

Semiconductor packaging

OSAT management

Global teams

Materials science

Education

Ph.D. or Master’s in Mechanical Engineering, Materials Science, Microelectronics, or Physics

Tools

EDA tool chains

Job description

SiTime seeks a seasoned packaging leader to drive its co-packaged MEMS strategy and execution. You will lead a cross-functional team spanning materials, mechanical design, and OSAT partners to deliver robust, scalable packaging solutions.

The role requires strong leadership, 10+ years in semiconductor packaging R&D and experience with advanced heterogeneous integration. A track record of global team leadership and collaboration with foundries is essential.