Senior MMIC Packaging Engineer - Lead Innovation & Yields

Mini-Circuits; Carlsbad (CA); On-site; USD 130,000 - 165,000; Full time

Job summary

Mini-Circuits in Carlsbad, CA is seeking a Sr. Packaging Engineer to lead MMIC packaging development and drive innovation across design, materials, and manufacturing.

You will collaborate with Quality & Reliability, CAD and contract packagers to move projects from concept to release, ensuring performance, yields, and cost targets. The role requires strong experience in packaging design, process development, and project management, with a focus on manufacturability and reliability in RF/microwave

Qualifications

• BSME with 7+ years in engineering; semiconductor packaging experience preferred.
• MSME or equivalent advanced degree is advantageous.

Responsibilities

• Lead design and development of manufacturable package assembly drawings with MMIC engineers.
• Lead MMIC packaging discussions with internal/external packaging houses.
• Maintain and create new package designs (laminate, leadframe, overmold, air cavity).
• Collaborate with factories on materials systems and packaging platforms.
• Design tooling/fixturing to facilitate assembly and manufacturing.
• Improve manufacturing techniques through new epoxies and interconnect methods.
• Perform design reviews and modify designs to improve yield and cost.
• Ensure thorough documentation and version control for designs.

Skills

MMIC packaging

Packaging design

2D/3D CAD

Process development

Manufacturing liaison

Project management

Education

BSME

MSME or equivalent preferred

Tools

AutoCAD

Draftsight

Inventor

SolidWorks

Job description

Mini-Circuits in Carlsbad, CA is seeking a Sr. Packaging Engineer to lead MMIC packaging development and drive innovation across design, materials, and manufacturing.

You will collaborate with Quality & Reliability, CAD and contract packagers to move projects from concept to release, ensuring performance, yields, and cost targets. The role requires strong experience in packaging design, process development, and project management, with a focus on manufacturability and reliability in RF/microwave