Process Engineer, High-Power LED Packaging & NPI

Luminus Devices; Sunnyvale (CA); On-site; USD 130,000 - 175,000; Full time

Benefits offered by this job

401k with employer match

Paid time off

Flexible spending accounts

Employee assistance program

Life/AD&D insurance

Job summary

Luminus Devices in Sunnyvale, CA is seeking a Process Engineer with a strong background in semiconductor packaging to advance high power LED products. The role splits time between process engineering and leading New Product Introduction efforts, with emphasis on wire bonding, die attach, and dispensing.

You will collaborate with contract manufacturers in Asia, manage projects, and drive cost/performance improvements while traveling up to 20% as needed.

Qualifications

• Master or PhD degree in engineering, physics, materials or related fields.
• Minimum 5 years in manufacturing processing of semiconductor packages (wire bonding, die attach, dispensing).
• Experience with high power LED packages is preferred.
• Familiar with lead frame and ceramic package technologies with copper heat spreaders.
• Experience with hermetic sealing, over molding and transfer/injection molding processes.

Responsibilities

• Develop recipes for wire bonding, die attach and dispensing for a low-volume prototype line.
• Build control plans and monitor via destructive tests and SPC.
• Publish lot reports and pareto analyses of yield losses.
• Transfer recipes and control plans to high-volume partners in Asia.
• Collaborate with Asian contract manufacturers to co-develop LED packages from concept to mass production.

Skills

wire bonding

die attach

dispensing

project management

leadership

Education

Master's or PhD in engineering/physics/materials

Tools

D/PFMEA

Contract manufacturers (CMs)

Job description

Luminus Devices in Sunnyvale, CA is seeking a Process Engineer with a strong background in semiconductor packaging to advance high power LED products. The role splits time between process engineering and leading New Product Introduction efforts, with emphasis on wire bonding, die attach, and dispensing.

You will collaborate with contract manufacturers in Asia, manage projects, and drive cost/performance improvements while traveling up to 20% as needed.