Lead OLED Micro-Display Process Engineer

Kopin Corporation; Westborough (MA); On-site; USD 165,000 - 195,000; Full time

Job summary

Kopin Corporation invites applications for a Sr. OLED Micro-Display Process Engineer to lead development, optimization, and manufacturing of high-resolution micro-displays for AR/VR, medical imaging, defense, and consumer electronics.

Responsibilities include process development for OLED thin-film deposition (thermal evaporation, sputtering, ALD), emissive stack engineering, encapsulation, DOE optimization, and transfer to high-volume manufacturing.

Qualifications

• BS in Chemical Engineering, Materials Science, Electrical Engineering, Physics or similar.
• MS/PhD strongly preferred; relevant industrial experience may substitute.
• 5+ years of hands-on process engineering in OLED device fabrication or related fields.
• Experience with vacuum thermal evaporation and organic thin-film deposition in cleanroom environments.
• Proven ability to move processes from concept to high-volume manufacturing, including DOE and data analysis.

Responsibilities

• Design, develop, and optimize OLED thin-film deposition processes (thermal evaporation, sputtering, ALD).
• Own process modules for emissive stack engineering and encapsulation for micro-displays.
• Define and execute DOE to optimize layer thickness, doping, and process conditions.
• Lead integration across OLED stack and backplane to meet electrical and optical targets.

Skills

OLED device fabrication

Thin-film deposition

DOE planning

Statistical analysis

Backplane integration

Leadership

Education

Bachelor's degree in a related field

MS/PhD preferred

Tools

VTE systems

ALD/CVD equipment

XRD

XPS

SEM/TEM

Job description

Kopin Corporation invites applications for a Sr. OLED Micro-Display Process Engineer to lead development, optimization, and manufacturing of high-resolution micro-displays for AR/VR, medical imaging, defense, and consumer electronics.

Responsibilities include process development for OLED thin-film deposition (thermal evaporation, sputtering, ALD), emissive stack engineering, encapsulation, DOE optimization, and transfer to high-volume manufacturing.