Senior Materials Engineer, Advanced Packaging & 3D Memory

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 120,000 - 170,000

Full time

12 days ago

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Benefits offered by this job

Medical, dental, vision
Paid time off
Retirement programs

Job summary

1000 Micron Technology, Inc. in Boise, Idaho seeks a Senior Materials Engineer/Scientist for Advanced Packaging Technology Development to define the materials foundation for next-generation memory and packaging technologies.

You will develop and integrate new materials, improving performance, reliability, and cost. You will collaborate with cross-disciplinary teams and external partners, drive experiments, analyze data, and apply AI tools to accelerate solutions in areas like die-attach

Qualifications

  • MS or PhD in materials-related field with strong focus.
  • Strong fundamentals in structure-property-process-performance relationships.
  • Clear technical communication and cross-disciplinary collaboration.

Responsibilities

  • Develop, characterize, qualify, and integrate advanced materials for memory and packaging.
  • Design and run rigorous experiments; analyze data to guide material decisions.
  • Collaborate with process, integration, product, manufacturing, quality, equipment, and supplier teams.
  • Work with suppliers, universities, and research organizations to evaluate new materials technologies.
  • Use modeling, simulation, data analytics, and AI tools to speed up materials development and problem solving.

Skills

Problem solving
Communication
Collaboration
Independence
AI/Modeling tools

Education

MS or PhD in Materials Science/Engineering or related field

Job description

1000 Micron Technology, Inc. in Boise, Idaho seeks a Senior Materials Engineer/Scientist for Advanced Packaging Technology Development to define the materials foundation for next-generation memory and packaging technologies.

You will develop and integrate new materials, improving performance, reliability, and cost. You will collaborate with cross-disciplinary teams and external partners, drive experiments, analyze data, and apply AI tools to accelerate solutions in areas like die-attach

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