Process Engineer, Advanced Packaging for Memory Tech

Micron Technology, Inc.; Boise (ID); Hybrid; USD 90,000 - 130,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Process Engineer to improve quality, reliability, and manufacturability of memory products. You will combine hands-on problem solving with cross-functional collaboration to drive technology advancements and scalable solutions.

The role focuses on optimizing automation, equipment, and processes, and requires strong root cause analysis, DOE/SPC experience, and data-driven decision making within a fast-paced development environment.

Qualifications

• BS with 3+ years of experience, MS with 1+ year of experience, or PhD in a relevant technical field
• Experience in semiconductor process engineering, packaging, or advanced package integration
• Knowledge of DRAM, NAND, or other memory technologies
• Experience with design of experiments (DOE), statistical process control (SPC), defect analysis, and data analysis
• Ability to solve complex technical problems using root cause analysis and manage project deliverables effectively

Responsibilities

• Optimize automation, equipment, and process performance to improve product quality, reliability, and cost
• Develop and enhance host, automation, and data systems to accelerate learning and decision-making
• Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC
• Partner with equipment, process development, and process integration teams to develop and implement new solutions
• Support pilot line operations and technology transfer to high-volume manufacturing sites

Skills

Root cause analysis

DOE

SPC

Data analysis

Cross-functional collaboration

Education

BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics

MS in related field or PhD

Tools

Automation systems

AI tools

DOE software

Job description

Micron Technology, Inc. in Boise, Idaho is seeking a Process Engineer to improve quality, reliability, and manufacturability of memory products. You will combine hands-on problem solving with cross-functional collaboration to drive technology advancements and scalable solutions.

The role focuses on optimizing automation, equipment, and processes, and requires strong root cause analysis, DOE/SPC experience, and data-driven decision making within a fast-paced development environment.