Senior IO Design Engineer – High-Speed Clocking for DRAM

Micron Technology, Inc.

Boise (ID)

Híbrido

USD 150 000 - 210 000

Tempo integral

14 dias+

Uma candidatura completa num minuto

Currículo e carta de apresentação personalizados, prontos a enviar.

Ultrapassa os filtros ATS

Vantagens oferecidas por esta oferta de emprego

Medical/Dental/Vision plans
Paid time off
Paid holidays
Relocation assistance TBD

Resumo da oferta

Micron Technology, Inc. in Boise, Idaho, seeks a Principal IO/Clocking Design Engineer to lead development of high-speed IO and clocking circuits for DRAM products, performing modelling, verification and optimization across full-chip and system levels.

The role emphasizes strong fundamentals in analog/mixed-signal design, Cadence and UNIX, collaboration with product engineering, SI, and process teams, and mentoring junior engineers.

Qualificações

  • Design, optimize and verify high-speed IO/clocking circuits for DRAM products.
  • Deep understanding of device physics and CMOS processing techniques.
  • Experience coordinating layout to minimize parasitics in high-speed paths.

Responsabilidades

  • Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products.
  • Apply proven high-speed circuit design techniques and evaluate IO/clocking performance at circuit and system levels.
  • Develop modeling and simulation methods to capture key metrics and correlate with silicon.
  • Collaborate with Product Engineering, SI and process teams on next-generation nodes.
  • Mentor junior engineers and contribute to cross-team design reviews.

Conhecimentos

High-speed design
Analog/Mixed-signal
Cadence
Unix
Layout supervision
Technical communication

Formação académica

MSEE
BSEE

Ferramentas

Cadence

Descrição da oferta de emprego

Micron Technology, Inc. in Boise, Idaho, seeks a Principal IO/Clocking Design Engineer to lead development of high-speed IO and clocking circuits for DRAM products, performing modelling, verification and optimization across full-chip and system levels.

The role emphasizes strong fundamentals in analog/mixed-signal design, Cadence and UNIX, collaboration with product engineering, SI, and process teams, and mentoring junior engineers.

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