Senior IC Packaging Simulation Engineer

Skyworks Solutions, Inc.; Irvine (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Skyworks Solutions, Inc. in Irvine, CA is seeking an experienced Mechanical Engineer to lead thermo-mechanical simulations for advanced IC packaging.

You will develop FEM models, assess reliability under thermal cycling and mechanical loads, and drive design improvements across cross-functional teams. The role involves automating workflows, mentoring teams, and collaborating with suppliers to ensure high-yield, robust packaging solutions ready for production.

Qualifications

• BS with 8+ years, MS with 6+ years, or a PhD with 3+ years of experience in Mechanical Engineering or a related field.
• Strong fundamentals in solid mechanics, heat transfer, materials science, and reliability engineering.
• Hands-on experience with finite element analysis (FEA) tools such as ANSYS (APDL and Workbench), Icepak, ABAQUS, FloTHERM, COMSOL, or equivalent simulation platforms.

Responsibilities

• Develop detailed thermo-mechanical finite element models (FEM) of IC packages to evaluate stress, strain, and deformation induced by package assembly processes, ensuring robust designs and high manufacturing yield.
• Perform mechanical reliability simulations to characterize package behavior under accelerated reliability test conditions, including thermal cycling, temperature-humidity-bias, power cycling, and mechanical loading, and predict package lifetime and failure mechanisms.
• Setup moldflow simulation models to predict molding process risks including mold fillability, mold pressure distribution, warpage etc.
• Perform second level reliability simulations to predict solder joint lifetimes under thermal cycling, drop/shock and cyclic bending load conditions.
• Create, maintain, and document simulation methodologies, modeling procedures, automation scripts, and analysis workflows. Communicate results and recommendations effectively to cross-functional engineering teams through technical reports and presentations.
• Collaborate with material suppliers, test laboratories, and internal characterization teams to obtain and validate material properties required for accurate thermal and mechanical modeling.
• Support Package & PCB design, Component Integration and New Technology Introduction (NTI) activities by providing simulation-driven insights and recommendations to improve package performance, reliability, manufacturability, and cost.
• Develop automated simulation workflows and scripting solutions to improve modeling efficiency, reduce turnaround time, and enable scalable analysis across multiple product platforms.
• Work closely with package development, product engineering, reliability, manufacturing, and process teams to identify and resolve design and reliability challenges throughout the product development cycle.
• Correlate simulation predictions with experimental measurements and failure analysis results to continuously improve model accuracy and predictive capability.
• Stay current with advancements in IC packaging technologies, simulation methodologies, material characterization techniques, and industry standards, and drive the adoption of best practices across the organization.

Skills

Strong communication

Presentation

Problem solving

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Mechanical Engineering

PhD in Mechanical Engineering

Tools

ANSYS

ABAQUS

Icepak

FloTHERM

COMSOL

Python

MATLAB

Job description

Skyworks Solutions, Inc. in Irvine, CA is seeking an experienced Mechanical Engineer to lead thermo-mechanical simulations for advanced IC packaging.

You will develop FEM models, assess reliability under thermal cycling and mechanical loads, and drive design improvements across cross-functional teams. The role involves automating workflows, mentoring teams, and collaborating with suppliers to ensure high-yield, robust packaging solutions ready for production.