IC Packaging Engineer: Thermal & Reliability Modeling

Skyworks Solutions, Inc; Irvine (CA); On-site; USD 114,000 - 220,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan with company match

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking an experienced mechanical engineer to lead thermal and mechanical simulations for advanced IC packaging. You will drive FEM modeling, reliability assessments, and integration with package and PCB design in a fast-paced environment at our Irvine, California site.

You will collaborate with multi-disciplinary teams to ensure high-yield, reliable packaging solutions from concept through production, while advancing automated workflows and best practices in modeling.

Qualifications

• BS in Mechanical Engineering or related field with advanced thermals/mechanical focus.

Responsibilities

• Develop detailed thermo-mechanical FEM models of IC packages to evaluate stress, strain, and deformation.

Skills

Thermal and mechanical simulation

Solid mechanics

Heat transfer

Reliability engineering

Strong communication

Education

BS in Mechanical Engineering

MS in Mechanical Engineering

PhD in Mechanical Engineering

Tools

ANSYS

Icepak

ABAQUS

FloTHERM

COMSOL

Job description

Skyworks Solutions, Inc. is seeking an experienced mechanical engineer to lead thermal and mechanical simulations for advanced IC packaging. You will drive FEM modeling, reliability assessments, and integration with package and PCB design in a fast-paced environment at our Irvine, California site.

You will collaborate with multi-disciplinary teams to ensure high-yield, reliable packaging solutions from concept through production, while advancing automated workflows and best practices in modeling.