Senior Packaging Engineer - RF/Wireless Solutions

Skyworks Solutions, Inc; Irvine (CA); On-site; USD 129,000 - 248,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan with company match

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. in Irvine, CA seeks a highly experienced Principal Engineer to lead advanced semiconductor packaging and assembly technology development for next-generation RF and wireless products.

The role requires a deep expertise in packaging platforms, strong DOE/quality practices, and proven leadership across design, manufacturing, suppliers, and reliability teams to deliver scalable, high-performance solutions.

Qualifications

• BS degree in Mechanical Engineering, Materials Science, Process Engineering, Electrical Engineering, or a related discipline.
• 12+ years in semiconductor packaging, assembly process development, or advanced manufacturing (8+ years with an MS degree).
• Proven success developing and transferring packaging technologies into high-volume production.

Responsibilities

• Lead the development, qualification, and production ramp of advanced semiconductor packaging technologies.
• Drive process innovation across MCM, chip-and-wire, flip-chip, and SiP assembly platforms.
• Define and execute DOE plans, process optimization strategies, and root-cause investigations.
• Partner with design teams, manufacturing sites, equipment suppliers, and material vendors to enable next-generation package solutions.
• Improve product performance, manufacturability, yield, reliability, and cost through process and technology development.
• Evaluate and introduce new materials, equipment, and assembly processes.
• Guide technology qualification and reliability assessment activities.
• Lead complex cross-functional projects and influence strategic packaging decisions across the organization.
• Mentor engineers and contribute to Skyworks' long-term packaging technology roadmap.

Skills

SMT

Wire Bond

Molding

Singulation

EMI Sputter Shielding

ENIG Plating

Materials Development

Wafer DPS

Flip-Chip Assembly

Education

Bachelor's degree in Mechanical Engineering, Materials Science, Process Engineering, Electrical Engineering, or a related discipline

Tools

Cadence Allegro

APD

SiP design tools

Job description

Skyworks Solutions, Inc. in Irvine, CA seeks a highly experienced Principal Engineer to lead advanced semiconductor packaging and assembly technology development for next-generation RF and wireless products.

The role requires a deep expertise in packaging platforms, strong DOE/quality practices, and proven leadership across design, manufacturing, suppliers, and reliability teams to deliver scalable, high-performance solutions.