Senior IC Packaging Mechanical Simulation Engineer

QUALCOMM, Inc.; San Diego (CA); On-site; USD 160,000 - 240,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking a hands-on IC packaging FEA engineer in San Diego to advance mechanical simulations for current and future chipsets. You will build and maintain ANSYS models, drive CPI analyses, and influence design decisions across packaging technologies.

The role requires strong communication, project focus, and hands-on experience in semiconductor packaging, reliability testing, and DOE-driven validation. Travel may be occasional as needed.

Qualifications

• Bachelor's degree in Chemical/Electrical/Mechanical Engineering or related field.
• Master's degree in Chemical/Electrical/Mechanical Engineering or related field is a plus.
• PhD in Chemical/Electrical/Mechanical Engineering or related field is preferred.

Responsibilities

• Develop and maintain FEA models for IC packaging and CPI analysis.
• Perform warpage, SJR prediction, and reliability assessments across packaging technologies.
• Improve BKMs and DOE plans; correlate simulations with test data.

Skills

System/Package Design

High-Rel Analysis

DOE Methodologies

CPI Knowledge

Material characterization

Education

Bachelor's degree in Chemical/Electrical/Mechanical Engineering

Master's degree in related field

PhD in related field

Tools

ANSYS APDL/Workbench

Job description

Qualcomm Technologies, Inc. is seeking a hands-on IC packaging FEA engineer in San Diego to advance mechanical simulations for current and future chipsets. You will build and maintain ANSYS models, drive CPI analyses, and influence design decisions across packaging technologies.

The role requires strong communication, project focus, and hands-on experience in semiconductor packaging, reliability testing, and DOE-driven validation. Travel may be occasional as needed.