Senior Packaging Engineer – RF/Analog NPI Leader

Skyworks Solutions, Inc.; Nashua (NH); On-site; USD 123,000 - 255,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan with company match

Employee stock purchase plan

Paid time off (vacation, sick/wellness

Parental leave

Job summary

Skyworks Solutions, Inc. in Nashua, NH (and Austin, TX) seeks a Principal Packaging Engineer to lead package engineering for new products, spanning SOIC, QFN, lead-frame, LGA, BGA, and WLCSP. You will partner with R&D, device/process teams, and OSATs to drive design, material selection, qualification, and production release.

The role emphasizes leadership, cross-functional influence, and risk mitigation to ensure high-yield, cost-effective packaging solutions across global sites.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field.
• 10+ years of semiconductor packaging experience.
• Experience with NPI, package engineering and package design for SOIC, QFN, lead-frame, LGA, BGA, and WLCSP.
• Knowledge of JEDEC, IATF and AEC requirements for IC packaging and qualification.
• Strong knowledge of electronic packaging technologies, structures, materials, and processes.
• Experience with IC package modeling and simulation and packaging-related failure analysis.
• Strong understanding of product development, manufacturing processes, and supply-chain management.

Responsibilities

• Provide package-design support and material-selection guidance to enable high-yielding, reliable, and cost-effective products.
• Develop and introduce new packaging technologies while supporting existing and legacy products.
• Collaborate with cross-functional teams to confirm adherence to design and technology rules and to define technology choices, timelines, milestones, and deliverables for new product launches.
• Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.
• Work with Skyworks’ internal assembly operation in Mexicali and external OSAT partners across Asia to support assembly-site selection, qualification, and execution.
• Lead product-readiness reviews covering technology, capability, capacity, and cost for each product release.
• Conduct design, process, and technology risk assessments and coordinate reliability activities throughout technology development, NPI, and ramp-up to support Cpk and yield targets.
• Identify risks and challenges in the NPI process and develop practical mitigation plans.
• Collaborate openly with cross-functional teams to manage projects, resolve technical and operational problems, and address critical issues.
• Prepare clear status reports and executive-level updates on product readiness, risks, decisions, and recovery actions.

Skills

Semiconductor packaging

NPI

Package design

JEDEC/IATF/AEC

Packaging technologies

Modeling & failure analysis

Product development

Project management

Communication

Problem solving

Education

Bachelor's degree in Mechanical Engineering or related field

Job description

Skyworks Solutions, Inc. in Nashua, NH (and Austin, TX) seeks a Principal Packaging Engineer to lead package engineering for new products, spanning SOIC, QFN, lead-frame, LGA, BGA, and WLCSP. You will partner with R&D, device/process teams, and OSATs to drive design, material selection, qualification, and production release.

The role emphasizes leadership, cross-functional influence, and risk mitigation to ensure high-yield, cost-effective packaging solutions across global sites.