IC Packaging Engineer - Thermal & Reliability Leader

Skyworks Solutions, Inc; Irvine (CA); On-site; USD 114,000 - 220,000; Full time

Job summary

Skyworks Solutions, Inc. in Irvine, CA, is seeking a senior engineer to lead thermal and mechanical simulations for advanced IC packaging, from concept through production.

You will build detailed FEM models, drive reliability assessments, and partner with cross-functional teams to improve performance, manufacturability, and cost.

Join a fast-paced, collaborative environment at Skyworks that values innovation and rigorous analysis in a technology leader shaping wireless connectivity.

Qualifications

• Experience with thermal and mechanical simulation of electronic packages.
• Strong fundamentals in solid mechanics, heat transfer and reliability.
• Experience with IC package modeling and simulation.
• Experience modeling die attach, wire bonding, molding and board assembly.
• Ability to communicate results to cross-functional teams.
• Experience with experimental validation and reliability testing is a plus.

Responsibilities

• Develop detailed thermo-mechanical FEM models of IC packages to evaluate stress, strain, and deformation.
• Perform mechanical reliability simulations for accelerated test conditions and lifetime predictions.
• Setup moldflow models to predict molding process risks such as fill, pressure and warpage.
• Perform second level reliability simulations for solder lifetimes under various loading.
• Create, maintain, and document simulation methodologies and workflows.
• Collaborate with material suppliers, test labs, and internal teams to validate properties.
• Support Package & PCB design and NTI activities with simulation insights.
• Develop automated simulation workflows to improve efficiency and scalability.
• Work with cross-functional teams to resolve design and reliability challenges.
• Correlate simulations with experimental data and failure analysis results.
• Stay current with IC packaging tech and drive best practices across the organization.
• Communicate results through technical reports and presentations.

Skills

Solid mechanics

Heat transfer

Reliability engineering

Cross-functional collaboration

Presentation skills

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Mechanical Engineering

PhD in Mechanical Engineering

Tools

ANSYS

Icepak

ABAQUS

FloTHERM

COMSOL

Job description

Skyworks Solutions, Inc. in Irvine, CA, is seeking a senior engineer to lead thermal and mechanical simulations for advanced IC packaging, from concept through production.

You will build detailed FEM models, drive reliability assessments, and partner with cross-functional teams to improve performance, manufacturability, and cost.

Join a fast-paced, collaborative environment at Skyworks that values innovation and rigorous analysis in a technology leader shaping wireless connectivity.