Lead Principal Packaging Engineer – Next-Gen RF

Skyworks Solutions, Inc.; Irvine (CA); On-site; USD 129,000 - 248,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan with company match

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking a highly experienced Principal Engineer to lead development of advanced semiconductor packaging and assembly technologies for next-generation RF and wireless products. Irvine, CA is preferred, with exceptional candidates considered for other locations.

You will partner across design, manufacturing, suppliers, reliability, and customer teams to deliver high-performance packaging solutions that meet aggressive cost and quality targets.

Qualifications

• BS degree in Mechanical Engineering, Materials Science, Process Engineering, Electrical Engineering, or a related discipline.
• 12+ years of experience in semiconductor packaging, assembly process development, or advanced manufacturing (8+ years with an MS degree).
• Proven success developing and transferring packaging technologies into high-volume production.

Responsibilities

• Lead the development, qualification, and production ramp of advanced semiconductor packaging technologies.
• Drive process innovation across MCM, chip-and-wire, flip-chip, and SiP assembly platforms.
• Define and execute DOE plans, process optimization strategies, and root-cause investigations.
• Partner with design teams, manufacturing sites, equipment suppliers, and material vendors to enable next-generation package solutions.
• Improve product performance, manufacturability, yield, reliability, and cost through process and technology development.
• Evaluate and introduce new materials, equipment, and assembly processes.
• Guide technology qualification and reliability assessment activities.
• Lead complex cross-functional projects and influence strategic packaging decisions across the organization.
• Mentor engineers and contribute to Skyworks' long-term packaging technology roadmap.

Job description

Skyworks Solutions, Inc. is seeking a highly experienced Principal Engineer to lead development of advanced semiconductor packaging and assembly technologies for next-generation RF and wireless products. Irvine, CA is preferred, with exceptional candidates considered for other locations.

You will partner across design, manufacturing, suppliers, reliability, and customer teams to deliver high-performance packaging solutions that meet aggressive cost and quality targets.