IC Package Integration Engineer — Semiconductors

MaziCTools; Los Angeles (CA); Híbrido; USD 34 000 - 50 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Employee stock plan

Stock grants

Medical and dental coverage

Resumo da oferta

Apple in Alabama is seeking an IC Package Integration Engineer to drive packaging integration from concept to high-volume manufacturing. You will lead cross-functional teams and coordinate with OSAT partners to deliver cutting-edge packaging solutions for drives and related assemblies.

The role requires hands-on semiconductor packaging expertise, significant experience, and the ability to travel up to 10% globally to collaborate with suppliers and production sites.

Qualificações

• Experience in semiconductor bundling configuration and process improvements.
• Strong cross-functional collaboration across teams and suppliers.

Responsabilidades

• Lead packaging integration and design across functional teams.
• Collaborate with external OSAT to move packaging solutions from concept to high-volume manufacturing, with up to 10% travel.

Conhecimentos

Bundling configuration

Cross-functional collaboration

Problem solving

Team leadership

Formação académica

BS degree or higher

Ferramentas

Rhythm APD

Allegro

Descrição da oferta de emprego

Apple in Alabama is seeking an IC Package Integration Engineer to drive packaging integration from concept to high-volume manufacturing. You will lead cross-functional teams and coordinate with OSAT partners to deliver cutting-edge packaging solutions for drives and related assemblies.

The role requires hands-on semiconductor packaging expertise, significant experience, and the ability to travel up to 10% globally to collaborate with suppliers and production sites.