IC Packaging Integration Engineer

Apple, Inc.; Jackson (TN); Presencial; USD 185 000 - 325 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Comprehensive medical and dental

Retirement benefits

Employee stock programs

Employee Stock Purchase Plan

Discounted products and services

Relocation assistance

Resumo da oferta

Apple, Inc. is seeking a versatile IC Packaging Engineer to join our team in the United States.

You will develop IC packaging and lead SoC package integration and architecture efforts, working with cross-functional partners to deliver high-density, reliable interconnect solutions. You will apply advanced AI/ML and data analytics to optimize processes, evaluate new materials, and ensure mechanical, thermal, and electrical performance.

Qualificações

• BS and 10+ years of experience in relevant industry.
• MS/PhD and 6+ years in semiconductor packaging or system integration.
• Strong understanding of multi-functional packaging areas and reliability, testing, FA and package-system integration.

Responsabilidades

• IC packaging development.
• Lead SoC package integration and architecture efforts.
• Drive advanced packaging solutions, materials, and reliability.

Conhecimentos

Semiconductor packaging

System integration

FOWLP/2.5D/3D packaging

Allegro schematic review

Problem solving

Communication skills

Formação académica

Bachelor's degree

MS/PhD in related field

Ferramentas

Allegro

Descrição da oferta de emprego

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team!

Description

• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs

Responsibilities

• Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.
• Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).
• Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
• Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.
• Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.

Preferred Qualifications

• MS/PhD and 6+ years of experience in relevant industry.
• We are looking for someone experienced in the semiconductor packaging and/or system integration.
• Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
• Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
• Excellent problem solving with strong physics and fundamentals.
• Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
• Basic knowledge of signal integrity/power integrity.
• Ability to review schematics, package/PCB layout and designs in Allegro.

Minimum Qualifications

BS and 10+ years of experience in relevant industry experience

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

• Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs.
• Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan.
• Comprehensive medical and dental coverage
• retirement benefits
• a range of discounted products and free services
• reimbursement for certain educational expenses - including tuition
• Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.