R&D Packaging & Signal Integrity Intern — High‑Speed RF

Keysight Technologies; Colorado Springs (CO); On-site; USD 48,000 - 54,000; Full time

Job summary

Keysight Technologies in Colorado Springs is seeking an engineering-minded candidate to design and optimize ASIC packaging and subsystems. You will work with systems, IC design, and test teams to ensure performance, reliability, and manufacturability of RF and high-speed interconnects.

Responsibilities include layout, SI/PI analysis, and power delivery network design, with lifecycle support for existing ASIC components.

Qualifications

• Pursuing BS, MS or PhD in Electrical/Mechanical/Materials Engineering or equivalent required.
• CAD Modeling and/or Simulation coursework and in-school experience expected.
• Understanding of Electrical Engineering and RF signal integrity principles required.

Responsibilities

• ASIC package, module, and subsystem development including layout, integration, SI/PI analysis, and power delivery network design.
• Modeling & optimization of high-frequency RF and high-speed digital I/O interconnects.
• Collaborate with system, IC design, and test teams to develop hardware architecture, requirements, functionality, and performance.
• Work with test & reliability teams for characterization and qualification of ASICs.
• Lifecycle support for existing ASIC components.

Skills

Electrical engineering

RF signal integrity

CAD Modeling

Education

BS/MS/PhD in Electrical/Mechanical/Materials Engineering or equivalent

Tools

CAD tools

Job description

Keysight Technologies in Colorado Springs is seeking an engineering-minded candidate to design and optimize ASIC packaging and subsystems. You will work with systems, IC design, and test teams to ensure performance, reliability, and manufacturability of RF and high-speed interconnects.

Responsibilities include layout, SI/PI analysis, and power delivery network design, with lifecycle support for existing ASIC components.