Advanced Package Development Engineer

Apple Inc.; San Francisco (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Apple Inc. is seeking engineers in the San Francisco Bay Area to drive advanced packaging and technology development for next generation products. You will work with world‑class engineers to solve complex integration challenges and move packaging innovations from concept to mass production.

Role requires deep packaging expertise, a self‑motivated approach, and strong engineering excellence. You will collaborate across silicon, firmware, and system teams and partner with suppliers to enable

Qualifications

• Has deep expertise in semiconductor packaging or related disciplines.
• Drives difficult technical problem solving with high engineering standards.
• Self-motivated and comfortable navigating ambiguity.
• Experience with advanced packaging and cross-functional collaboration.

Responsibilities

• Develop and qualify advanced packaging technologies for next‑gen products.
• Drive package integration across silicon, firmware, and system teams.
• Lead characterization and failure analysis to identify root causes and corrective actions.
• Collaborate with external suppliers and foundries for materials and tech transfer.
• Define and execute test vehicles and experiments for packaging concepts.

Skills

Semiconductor packaging

Problem solving

Engineering excellence

Ambiguity navigation

Education

Bachelor's degree in a related field

PhD (preferred)

Tools

TCAD

JMP

Virtuoso

KLayout

Ansys EDT

Job description

San Francisco Bay Area, California, United States Hardware

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next‑generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry‑leading silicon performance. You'll work alongside world‑class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

• Has deep expertise in semiconductor packaging or related disciplines
• Thrives on solving difficult technical problems
• Holds themselves to a high standard of engineering excellence
• Is self‑motivated and comfortable navigating ambiguity

Responsibilities

• Develop and qualify advanced packaging technologies including substrate design, interconnect architectures, and assembly processes to meet performance, power, and form factor requirements for next‑generation products.
• Drive package integration across silicon, firmware, and system teams to ensure co‑optimization of die architecture, package design, and thermal/mechanical constraints.
• Lead characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective actions.
• Partner with external suppliers and foundries to evaluate new materials and processes, establish specifications, and enable technology transfer to high‑volume manufacturing.
• Define and execute test vehicles and experiments to validate packaging concepts, establish design rules, and generate data for product design decisions.

Minimum Qualifications

• BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications

• PhD and 6+ years of experience in relevant industry preferred.
• Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ‑bumps, hybrid bonds, TSVs, etc.
• Deep knowledge of electrical, mechanical and thermal properties of fab materials.
• Strong expertise in Si Fab equipment and Fab Logistics Management.
• Experience on advanced packaging for groundbreaking CMOS nodes.
• Expertise on Si structure yield and reliability mechanisms and analyses.
• Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
• Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
• Capable of independent R&D Work in a cross‑functional team, driving vendors.
• Experience in Si fab integration role and advanced packaging.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

Apple accepts applications to this posting on an ongoing basis.