Advanced Packaging Engineer - Si/Package Integration

Apple Inc.

San Francisco (CA)

On-site

USD 180,000 - 260,000

Full time

14 days+

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Job summary

Apple Inc. is seeking engineers in the San Francisco Bay Area to drive advanced packaging and technology development for next generation products. You will work with world‑class engineers to solve complex integration challenges and move packaging innovations from concept to mass production.

Role requires deep packaging expertise, a self‑motivated approach, and strong engineering excellence. You will collaborate across silicon, firmware, and system teams and partner with suppliers to enable

Qualifications

Has deep expertise in semiconductor packaging or related disciplines.
Drives difficult technical problem solving with high engineering standards.
Self-motivated and comfortable navigating ambiguity.
Experience with advanced packaging and cross-functional collaboration.

Responsibilities

Develop and qualify advanced packaging technologies for next‑gen products.
Drive package integration across silicon, firmware, and system teams.
Lead characterization and failure analysis to identify root causes and corrective actions.
Collaborate with external suppliers and foundries for materials and tech transfer.
Define and execute test vehicles and experiments for packaging concepts.