Senior Hardware Designer - High-Speed PCB & FPGA

Fidus Systems

New York (NY)

On-site

USD 110,000 - 165,000

Full time

15 hours ago
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Benefits offered by this job

Medical, dental, and vision plans
403(k) / 401(k) matching
Profit-sharing bonus

Job summary

Fidus Systems in the United States is seeking a Hardware Designer to architect and deliver complex, high-performance electronic systems from concept through bring-up and validation. You will collaborate with FPGA, software, and SI/PI teams, lead design reviews, develop test plans, and mentor junior engineers while ensuring robust, production-ready hardware and clear documentation.

You will bring 5+ years of hands-on experience with high-speed signaling, multi-layer PCB design, and a strong

Qualifications

  • Bachelor’s degree in Electrical or Computer Engineering or equivalent.
  • Minimum 5 years of direct electronics design experience.
  • Ability to lead a design technically and as a mentor.

Responsibilities

  • Architect system and board-level designs with cross-functional teams.
  • Design high-speed circuits (DDR4, PCIe Gen4, SerDes) and memory busses.
  • Conduct simulations (LTSpice) and verify circuits with prototypes.
  • Lead design reviews and develop test plans and documentation.
  • Mentor junior engineers and support customer engagements.

Skills

High-speed design
Mentor/lead
Signal integrity
PCB design
Verilog/RTL
Electrical engineering

Education

Bachelor's degree in Electrical or Computer Engineering

Tools

Cadence CIS
OrCAD Capture
Cadence Allegro
Oscilloscopes
VNA
LTSpice

Job description

Fidus Systems in the United States is seeking a Hardware Designer to architect and deliver complex, high-performance electronic systems from concept through bring-up and validation. You will collaborate with FPGA, software, and SI/PI teams, lead design reviews, develop test plans, and mentor junior engineers while ensuring robust, production-ready hardware and clear documentation.

You will bring 5+ years of hands-on experience with high-speed signaling, multi-layer PCB design, and a strong

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