Senior Hardware Design Engineer, High-Speed Networking

Hewlett Packard Enterprise; Sunnyvale (CA); On-site; USD 181,000 - 367,000; Full time

Job summary

Hewlett Packard Enterprise in California is seeking a Senior Hardware Design Engineer to lead next‑gen networking hardware. You will own the hardware lifecycle, design high‑density, high‑power boards, and work across FPGA, signal integrity, and thermal teams to deliver production‑ready systems.

The role emphasizes hands‑on leadership, system integration, and collaboration across hardware, firmware, software, mechanical, and manufacturing teams, with a focus on extreme bandwidth and density.

Qualifications

• 10+ years hands‑on hardware/board design experience with complex, high‑performance electronic systems.
• Experience designing high‑speed systems with 100G/200G‑class signaling or similar interfaces.
• Strong knowledge of SI/PI principles and high‑density, high‑power PCBs.
• Hands‑on FPGA design ability and hardware/firmware integration.

Responsibilities

• Own end‑to‑end hardware design lifecycle from architecture to production.
• Lead high‑performance, dense, high‑power PCB design with strict constraints.
• Design systems with 100G/200G signaling and high‑speed interfaces.
• Develop and review complex schematics, power architectures, clocks, and interfaces.
• Collaborate with thermal and mechanical teams on liquid cooling architectures.
• Identify technical risks and drive solutions to meet aggressive schedules.

Skills

High‑speed signaling

Signal Integrity (SI)

Power Integrity (PI)

FPGA design

Liquid cooling

Thermal management

Schematic design

PCB layout

System architecture

Cross‑functional collaboration

Tools

FPGA development tools

Job description

Hewlett Packard Enterprise in California is seeking a Senior Hardware Design Engineer to lead next‑gen networking hardware. You will own the hardware lifecycle, design high‑density, high‑power boards, and work across FPGA, signal integrity, and thermal teams to deliver production‑ready systems.

The role emphasizes hands‑on leadership, system integration, and collaboration across hardware, firmware, software, mechanical, and manufacturing teams, with a focus on extreme bandwidth and density.