SiP Layout Engineer: Flip-Chip & System-in-Package Expert

Analog Devices, Inc.; Wilmington, Northern (MA, KY); Hybrid; USD 117,000 - 161,000; Full time

Benefits offered by this job

Discretionary bonus

Medical, vision and dental coverage

401k

Paid vacation

Holidays and sick time

Job summary

Analog Devices, Inc. seeks an experienced SiP layout design engineer with strong expertise in laminate and PCB layout for advanced semiconductor packaging.

This role supports the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments. You will collaborate with IC design, package engineering, and product teams to ensure layouts meet specifications, perform DRC and design reviews, and manage multiple layout projects with realistic

Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
• 5+ years of hands-on experience in laminate, substrate, PCB, or advanced package layout design.
• Strong knowledge of laminate, substrate, and PCB layout principles, including routing, stack-up design, impedance control, and manufacturability constraints.

Responsibilities

• Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions.
• Design and optimize routing, power/ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups to meet electrical, thermal, mechanical, and reliability requirements.
• Work closely with IC design, package engineering, and product engineering teams to ensure layout designs meet product specifications and package requirements.
• Perform design rule checks, layout verification, and design reviews to ensure compliance with package, substrate, PCB, and assembly design rules.

Skills

Laminate layout

PCB layout

Team collaboration

Problem solving

Education

Bachelor’s degree in Electrical/Mechanical Engineering or related field

Tools

Cadence Allegro

CAD software

Job description

Analog Devices, Inc. seeks an experienced SiP layout design engineer with strong expertise in laminate and PCB layout for advanced semiconductor packaging.

This role supports the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments. You will collaborate with IC design, package engineering, and product teams to ensure layouts meet specifications, perform DRC and design reviews, and manage multiple layout projects with realistic