Senior ASIC Package Engineer — FC-BGA & Space MCM

K2 Space; Seattle (WA); On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Equity in the company

Paid time off

Medical coverage

Dental coverage

Vision coverage

Life insurance

Paid parental leave

Job summary

K2 Space in Seattle, WA seeks a Senior ASIC Package Design Engineer to lead FC‑BGA and MCM package architectures for high‑performance mixed‑signal and digital SoCs. You will collaborate across architecture, vendor engagement, qualification, and ramp to ensure first‑pass success for complex, high‑speed ASICs.

Join a fast‑growing, Series D‑funded company building the next generation of satellites. You’ll work with silicon, RF, and systems teams to define standards, optimize floorplans, and drive

Qualifications

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 5+ years of experience in ASIC package design, with deep expertise in FC‑BGA.
• Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.

Responsibilities

• Define ASIC package architecture for FC‑BGA and MCM solutions, including substrate stack-up and power delivery.
• Lead package-level trade studies across cost, performance, PI/SI, thermal, manufacturability, and reliability.
• Establish package design standards, methodologies, and best practices.
• Drive detailed design of FC‑BGA packages for high-pin-count ASICs with high-speed SerDes and dense power grids.
• Define and review substrate stack-ups, via strategies, impedance control, and reference plane planning.
• Partner with silicon, RF, and systems teams to co-optimized floorplans and package interfaces.
• Support package-level SI/PI strategy, PDN design, and decoupling strategy.
• Lead thermal architecture at the package level, including lid selection and heat-spreaders.
• Manage relationships with OSATs, substrate vendors, and OSATs.

Skills

FC-BGA

SI/PI

OSATs

Thermal management

EM simulation

Education

Bachelor’s degree in Packaging Engineering

Tools

SIWave

HFSS

ADS

Job description

K2 Space in Seattle, WA seeks a Senior ASIC Package Design Engineer to lead FC‑BGA and MCM package architectures for high‑performance mixed‑signal and digital SoCs. You will collaborate across architecture, vendor engagement, qualification, and ramp to ensure first‑pass success for complex, high‑speed ASICs.

Join a fast‑growing, Series D‑funded company building the next generation of satellites. You’ll work with silicon, RF, and systems teams to define standards, optimize floorplans, and drive