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K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and multi-chip module packaging strategies for high-performance SoCs, from early architecture through production ramp.
You will own end-to-end package architecture, drive SI/PI trade studies, power delivery, and thermal management, and engage OSATs and substrate vendors to ensure first-pass success for dense, high-speed ASICs. Collaboration with silicon and systems teams is essential.
K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and multi-chip module packaging strategies for high-performance SoCs, from early architecture through production ramp.
You will own end-to-end package architecture, drive SI/PI trade studies, power delivery, and thermal management, and engage OSATs and substrate vendors to ensure first-pass success for dense, high-speed ASICs. Collaboration with silicon and systems teams is essential.